Nicholas Costen - Greenbelt MD, US Sally Merritt - Austin TX, US
International Classification:
B65G 1/133
US Classification:
414749100
Abstract:
According to one embodiment of the invention, a system for die attach includes a wafer disposed outwardly from a carrier tape, the wafer having a plurality of die associated therewith, a pick head operable to, via a vacuum, pick up a die to be processed, and a shroud surrounding the pick head. A vacuum exhaust may be coupled to a sidewall of the shroud to redirect air leakage within the shroud generated by a bond force pressure chamber away from a top surface of the die to be processed and out of the shroud.
Cotton Incorporated - Greater New York City Area 2010 - Apr 2012
Marketing Coordinator
Guarisco Gallery Apr 2008 - Aug 2010
Gallery Associate/Sales & Marketing
The American Institute of Architects (AIA) - Washington, D.C. Oct 2007 - Apr 2008
Membership Services Assistant
Education:
College of Charleston 2003 - 2007
BA, Art History, Arts Management
Thayer Academy 1999 - 2003