An improved metal etching process including preparation of a metal substrate, developing a photoresist on the substrate, coating the exposed substrate with electroless phosphorous nickel alloy, removing the developed photoresist and etching the then exposed substrate. The preparation for depositing the electroless nickel includes washing the surface of the substrate with a very dilute acidic ferric chloride solution, immersing the substrate in a hydrochloric acid solution, and applying a thin metal layer by electrolytic plating, seriatim.
Sai Lee (2002-2006), Oscar Segura (2003-2007), Elizabeth Rodriguez (2004-2008), Alexis Duarte (2003-2007), Julien Bell (2005-2009), Jennifer Decker (2000-2004)