Saeid Azemati from 103 Blake St, Newton, MA 02460, age 70

Temperature Stabilizing Packaging For Optoelectronic Components In A Transmitter Module
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US Patent:

20080187325, Aug 7, 2008
Filed:

Feb 4, 2008
Appl. No.:

12/025573
Inventors:

Kevin J. McCallion - Charlestown MA, US
Michael G. Deutsch - Derry NH, US
Parviz Tayebati - Boston MA, US
Saeid Azemati - Auburndale MA, US
International Classification:

H04B 10/04
US Classification:

398192
Abstract:

An optical transmitter is disclosed having a temperature stabilization system for an optical filter for maintaining constant the frequency response of the filter. The filter is mounted within a housing having a substantially higher thermal conductivity. The housing may include a copper-tungsten alloy and extend along the optical axis of the filter. The housing is in thermal contact with a thermo-electric cooler (TEC) and a temperature sensor. The TEC and temperature sensor are electrically coupled to a controller which adjusts the temperature of the TEC according to the output of the temperature sensor.

Thermal Management Of A Locker Etalon In A Transmitter Optical Subassembly
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US Patent:

20120076505, Mar 29, 2012
Filed:

Sep 27, 2011
Appl. No.:

13/246779
Inventors:

Saeid Azemati - Auburndale MA, US
Farhang Sakhitab - Chestnut Hill MA, US
Jamie Lars Silva - Sudbury MA, US
Assignee:

FINISAR CORPORATION - Sunnyvale CA
International Classification:

H04B 10/04
US Classification:

398201
Abstract:

Thermal management of a locker etalon in a transmitter optical subassembly (TOSA). In one example embodiment, a TOSA includes a case, a laser positioned within the case and electro-thermally connected to the case, a locker etalon positioned in the case and thermally connected to the case, and a thermoelectric cooler (TEC) positioned within the case and in thermal contact with both the laser and the locker etalon.

Co-Packaging Photonic Integrated Circuits And Application Specific Integrated Circuits
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US Patent:

20130308898, Nov 21, 2013
Filed:

Apr 26, 2013
Appl. No.:

13/871331
Inventors:

Eric SWANSON - MAYNARD MA, US
Diedrik VERMEULEN - MAYNARD MA, US
Saeid AZEMATI - MAYNARD MA, US
Jon STAHL - MAYNARD MA, US
International Classification:

G02B 6/12
US Classification:

385 14
Abstract:

Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

Co-Packaging Photonic Integrated Circuits And Application Specific Integrated Circuits
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US Patent:

20180203187, Jul 19, 2018
Filed:

Jan 12, 2018
Appl. No.:

15/870468
Inventors:

- Maynard MA, US
Eric Swanson - Gloucester MA, US
Diedrik Vermeulen - Somerville MA, US
Saeid Azemati - Newton MA, US
Jon Stahl - Wayland MA, US
Assignee:

Acacia Communications, Inc. - Maynard MA
International Classification:

G02B 6/12
G02B 6/42
Abstract:

Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

Saeid Azemati