Ronald C Huber

US Patent:

6542837, Apr 1, 2003

Filed:

May 19, 2000

Appl. No.:

09/574823

Inventors:

Ronald Huber - Tucson AZ

Assignee:

Infineon Technologies AG - Munich

International Classification:

G06F 1900

US Classification:

702 81, 356336

Abstract:

A wafer processing system is described located in at least one clean room and having an arrangement of manufacturing units for performing individual manufacturing operations. In a manufacturing unit, measuring devices are provided for determining process parameters in order to check the quality of wafer processing of the manufacturing operations. Process data generated by the measuring devices is compiled continuously in a computing unit assigned to the manufacturing unit. Characteristic quantities for evaluating the quality of wafer processing are derived from this process data.

US Patent:

20130291523, Nov 7, 2013

Filed:

May 2, 2012

Appl. No.:

13/462165

Inventors:

Viresh B. Shah - Aurora IL, US
Paul Gerald Savich - Joliet IL, US
Ronald J. Huber - Elburn IL, US
Vivek Sundararaj - Peoria IL, US

Assignee:

CATERPILLAR, INC. - Peoria IL

International Classification:

F01N 3/10
H01L 23/467

US Classification:

60287, 165121

Abstract:

A diesel emission fluid (DEF) injection system for a machine is disclosed. The machine includes a fan or a source of flowing air, as well as a first portion of an exhaust system coupled to an exhaust after-treatment device and a second portion of the exhaust system disposed below the exhaust after-treatment device. The DEF injection system includes a DEF line in selective communication with the first portion of the exhaust system as well as electrical components such as an electrically activated valve for injecting the DEF into the first portion of the exhaust system. To maintain the electrical components at acceptably low temperatures, a heat shield is disposed between the electrical components and the second portion of the exhaust system and an air duct is provided that communicates air from the fan or source of flowing air towards the electrical components for forced air cooling.