Roger David Flynn

US Patent:

7715699, May 11, 2010

Filed:

Aug 10, 2006

Appl. No.:

11/502276

Inventors:

Kristina L. Lamers - Fort Collins CO, US
Patrick Chiang - Sacramento CA, US
Roger Flynn - Mountain View CA, US
Yang-ren Rau - Hsinchu, TW
Beth L. Pruitt - San Francisco CA, US
Aikaterina Ioakeimidi - San Francisco CA, US

Assignee:

Avago Technologies Wireless IP (Singapore) Pte. Ltd. - Singapore

International Classification:

A01G 13/06

US Classification:

392386, 392394

Abstract:

An electrically actuated liquid dispenser, an electrically addressable liquid dispenser and an electronic device are described.

US Patent:

20100314093, Dec 16, 2010

Filed:

Jun 7, 2010

Appl. No.:

12/795139

Inventors:

Gamal Refai-Ahmed - Markham, CA
Milnes David - Stanford CA, US
Amy Marconnet - Stanford CA, US
Josef Miler - Palo Alto CA, US
Roger Flynn - Tempe AZ, US
Kenneth E. Goodson - Portola Valley CA, US

International Classification:

G05D 23/00
F28D 15/00

US Classification:

165287, 16510431, 16510433

Abstract:

Various apparatus and methods for thermally managing a heat generating device. In one aspect, a method of thermally managing a heat generating device is provided that includes placing a heat exchanger in thermal communication with the heat generating device. The heat exchanger has an interior space. A membrane is in the interior space between a first chamber and a second chamber. The membrane has a gas impermeable portion and at least one gas permeable portion to enable vapor bubbles in the second chamber to pass through the membrane at the at least one gas permeable portion and into the first chamber. A liquid is moved through the second chamber.

US Patent:

20140002989, Jan 2, 2014

Filed:

Jun 27, 2012

Appl. No.:

13/535257

Inventors:

Sandeep Ahuja - University Place WA, US
Eric W. Buddrius - Lacey WA, US
Roger D. Flynn - Tempe AZ, US
Rajat Agarwal - Beaverton OR, US

International Classification:

H05K 7/20
H05K 13/00
G06F 1/20

US Classification:

36167954, 361704, 295921

Abstract:

In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM is minimized for the components.

US Patent:

20170162475, Jun 8, 2017

Filed:

Dec 3, 2015

Appl. No.:

14/958420

Inventors:

- Santa Clara CA, US
Eric D. McAfee - Portland OR, US
Shankar Krishnan - Portland OR, US
Juan G. Cevallos - Portland OR, US
Roger D. Flynn - Tempe AZ, US

International Classification:

H01L 23/473
H01L 23/00
H01L 23/367
H01L 21/48
B23P 15/26
G06F 1/20

Abstract:

Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

US Patent:

20160155682, Jun 2, 2016

Filed:

Feb 9, 2016

Appl. No.:

15/019931

Inventors:

- Santa Clara CA, US
Eric W. Buddrius - Lacey WA, US
Roger D. Flynn - Tempe AZ, US
Rajat Agarwal - Beaverton OR, US

International Classification:

H01L 23/36
H01L 25/00
H01L 25/065
H01L 23/433
H01L 21/48

Abstract:

In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.

US Patent:

20150170989, Jun 18, 2015

Filed:

Dec 16, 2013

Appl. No.:

14/108270

Inventors:

Hemanth K. Dhavaleswarapu - Chandler AZ, US
Roger D. Flynn - Tempe AZ, US
Sanjoy K. Saha - Chandler AZ, US

International Classification:

H01L 23/34
H01L 25/00

Abstract:

Embodiments of the present disclosure describe thermal management solutions for multichip package assemblies and methods of fabricating multichip package assemblies utilizing the thermal management solutions. These embodiments include multi-level heat spreaders and alleviate issues caused by dimensional variability in die-packages utilized in multichip package assemblies. In one embodiment a package heat spreader is thermally coupled to a first die-package and die-package heat spreader. The die-package heat spreader is thermally coupled to a second die-package and provides a thermal pathway to conduct heat from the second die-package to the package heat spreader. Other embodiments may be described and/or claimed.

Author:

Roger R. Flynn

ISBN #:

0028655664

Author:

Roger R. Flynn

ISBN #:

0028655672

Author:

Roger R. Flynn

ISBN #:

0028655680

Author:

Roger R. Flynn

ISBN #:

0028655699

Author:

Roger R. Flynn

ISBN #:

0028655702

Author:

Roger R. Flynn

ISBN #:

0824775082