Robert O Herendeen

US Patent:

8189189, May 29, 2012

Filed:

Oct 8, 2009

Appl. No.:

12/576138

Inventors:

Robert O. Herendeen - San Jose CA, US
James L. Beck - Los Gatos CA, US
Larry Perazzo - San Jose CA, US

International Classification:

G01J 3/44

US Classification:

356300, 356301

Abstract:

The invention relates to a device and method for monitoring a chemical reaction proceeding from a first state to a second state by emitting and detecting radiation in ranges of interest for a spectral signature of the material undergoing the chemical reaction. Using the concept of optical spectral detection and identification, it is therefore possible to utilize a combination of specific emitters and detectors, optics and signal processing in order to identify materials and events.

US Patent:

43052045, Dec 15, 1981

Filed:

Jan 16, 1980

Appl. No.:

6/112505

Inventors:

Victor J. Toggart - San Jose CA
Richard F. Kingsbury - San Jose CA
Robert O. Herendeen - Los Altos CA

Assignee:

Litronix, Inc. - Cupertino CA

International Classification:

H05K 330

US Classification:

29841

Abstract:

An alpha-numeric display device having a modular structure for placement side-by-side in vertical and horizontal formats to present symbols, words and phrases. The device functions as a stand-alone peripheral, appearing to a controller, such as a microprocessing device, as a random access memory. In particular, the device is operative to receive a standarized 7-bit ASCII code and to translate it to a multiple segment display whereby it can be continuously presented. The device provides a small, relatively low-cost alphabet and number display with a built-in electronic interface to a microprocessing unit permitting word communication to be incorporated into compact equipment, such as hand-held terminals and portable display devices. Complex interface circuitry is compactly packaged in a modular device by utilization of hybrid integrated circuit technology in which a multiple layer substrate provides interconnection between display units and semiconductor integrated circuit chips on opposing sides of the substrate. A multiple step PTF silkscreen printing process permits construction of a two-sided, compact display device with extremely thin, high resolution printed interconnections.