Robert Brian Crispell

US Patent:

6559535, May 6, 2003

Filed:

Feb 13, 2001

Appl. No.:

09/781423

Inventors:

Robert B. Crispell - Mohnton PA
Mark J. Nelson - Reading PA

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

H01L 2310

US Classification:

257710, 257666, 257668, 257704

Abstract:

A sealing package for an integrated circuit chip including a lead structure with first lead members and second lead members. The first lead members are located proximate the corners of the sealing package and have two lead portions external to the sealing package and one lead portion internal to the sealing package. The second lead members are fanned out along the sides of the sealing package and have one lead portion internal to the sealing package and one lead portion external to the sealing package. Each first lead member adapted to provide a connection to ground for at least two sides of the sealing package. Each second lead member adapted to provide a connection between an integrated circuit chip internal to the sealing package and external circuitry.

US Patent:

7423341, Sep 9, 2008

Filed:

Aug 16, 2006

Appl. No.:

11/505152

Inventors:

Robert B. Crispell - Whitehall PA, US
Robert Scott Kistler - Palmerton PA, US
John W. Osenbach - Kutztown PA, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

H01L 23/12
H01L 21/00
H05K 7/20

US Classification:

257704, 257707, 257713, 257724, 257E23103, 361709, 361711, 438122

Abstract:

The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

US Patent:

7632717, Dec 15, 2009

Filed:

Aug 15, 2008

Appl. No.:

12/228720

Inventors:

Robert B. Crispell - Whitehall PA, US
Robert Scott Kistler - Palmerton PA, US
John W. Osenbach - Kutztown PA, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

H01L 21/00
H01L 23/12
H05K 7/20

US Classification:

438122, 257704, 257707, 257713, 257724, 257E23103, 361709, 361711

Abstract:

The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

US Patent:

20080042302, Feb 21, 2008

Filed:

Aug 16, 2006

Appl. No.:

11/504989

Inventors:

Robert B. Crispell - Whitehall PA, US
Robert Scott Kistler - Palmerton PA, US
John W. Osenbach - Kutztown PA, US

International Classification:

H01L 23/28

US Classification:

257796

Abstract:

The specification describes lidded IC plastic overmolded packages with chimney-type heat sinks. The packages have mechanical hold-down structures in the package lids that, when overmold is applied, form complementary hold-down structures in the overmold.

US Patent:

60577002, May 2, 2000

Filed:

May 6, 1998

Appl. No.:

9/073279

Inventors:

Robert Brian Crispell - Mohnton PA

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

G01R 3102
G01R 3126

US Classification:

324765

Abstract:

A test fixture that exhibits relatively low parasitic impedance and inductance characteristics (thereby allowing for high speed --several GHz testing) while capable of high volume testing. The fixture utilizes a high dielectric test substrate with gold test leads for best performance. A two-piece test fixture is aligned with and attached to the substrate, with a layer of vertically conductive material disposed between the substrate and the fixture. A first component of the two-piece test fixture include a central aperture for holding the test package in alignment with the leads formed on the test substrate. A second component of the two-piece test fixture covers the package and exerts a predetermined force on the package leads, thereby inducing conductivity through the vertically conductive material and forming a conduction path from the substrate to the package leads.