Robert J Clementi

US Patent:

46816542, Jul 21, 1987

Filed:

May 21, 1986

Appl. No.:

6/865316

Inventors:

Robert J. Clementi - Binghamton NY
Charles E. Gazdik - Endicott NY
William Lafer - Chenango Bridge NY
Roy L. Lovesky - Vestal NY
Donald G. McBride - Binghamton NY
Joel V. Munson - Port Crane NY
Eugene P. Skarvinko - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C23F 102
B44C 122
B29C 3700
C03C 1500

US Classification:

156630

Abstract:

A method is disclosed for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape is made with window-like openings having a relatively thin layer of polyimide spanning the openings. The relatively thin layer of polyimide is transferred to the tape from a metal carrier foil, preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates which may be handled in the tape format for further processing. Preferably, the tape includes perforations for engaging sprockets of automated manufacturing equipment, or the like.

US Patent:

51455536, Sep 8, 1992

Filed:

May 6, 1991

Appl. No.:

7/696435

Inventors:

Stanley M. Albrechta - Binghamton NY
Robert J. Clementi - Binghamton NY
Thomas E. Kindl - Endwell NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B44C 122
B29C 3700
C23F 100

US Classification:

156640

Abstract:

A method of making a flexible circuit member including a stainless steel base member, a dielectric layer (polyimide) on the base member and a conductive circuit (copper) on the dielectric. The circuit member may be first formed as a laminate structure wherein the dielectric polyimide is coated on the stainless steel and appropriately treated (cured). The copper circuitry is then formed utilizing resist application and exposure techniques. Significantly, the copper-containing circuitry and stainless steel base member are simultaneously etched using a cupric chloride etchant solution to effectively remove desired portions of these metallic materials and produce the desired flexible circuit member.