Robert D Bond

US Patent:

6889813, May 10, 2005

Filed:

Jun 22, 2000

Appl. No.:

09/602162

Inventors:

Harold L. Trammell - Colleyville TX, US
Robert H. Bond - Plano TX, US

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

B65G037/00
B65G049/07

US Classification:

1983463, 19875011, 414940

Abstract:

A controlled material transport method for carrying materials to and from workstations, test equipment, and processing and assembly tools in a common facility. The present invention includes a rigid “robot vehicle” mountable to a passive track system, which can be routed to service all processing tools on the factory floor. The robot vehicle includes a hoist assembly and gripper assembly, which together perform such functions as picking up magazines, placing magazines, and loading magazines into the processing tools. The hoist assembly is capable of functioning in an operational envelope, which includes any target location within a 3-axis Cartesian coordinate system, to the extent of the range of motion of the hoist assembly. The hoist assembly also provides rigid and controlled z-axis travel, while being compact when retracted. The gripper assembly facilitates loading of the magazines, especially chute style magazines, which are commonly found on many existing processing tools.

US Patent:

7456050, Nov 25, 2008

Filed:

Jul 1, 2003

Appl. No.:

10/611153

Inventors:

Harry Michael Siegel - Hurst TX, US
Robert Henry Bond - Plano TX, US
Tom Quoc Lao - Murphy TX, US

Assignee:

STMicroelectronics, Inc. - Carrollton TX

International Classification:

H01L 21/00

US Classification:

438118, 257E21514

Abstract:

A system and method is disclosed for controlling a height and a planarity of an integrated circuit die. In one advantageous embodiment of the invention, a plurality of patterned metal stops are fabricated on an integrated circuit substrate and covered with die attach material. An integrated circuit die is inserted into the die attach material and placed into a clamping mechanism of a molding machine. The clamping mechanism (1) compresses the die into the die attach material, (2) rotates the die into parallel alignment with the substrate, and (3) pushes the die into contact with the patterned metal stops. In this manner the die height and the die planarity are precisely controlled.

US Patent:

D652332, Jan 17, 2012

Filed:

Mar 5, 2010

Appl. No.:

29/357084

Inventors:

Robert Henry Bond - Plano TX, US
Alan Kramer - Berkeley CA, US
Giovanni Gozzini - Berkeley CA, US

Assignee:

Authentec, Inc. - Melbourne FL

International Classification:

1005

US Classification:

D101041

US Patent:

D652333, Jan 17, 2012

Filed:

Mar 5, 2010

Appl. No.:

29/357086

Inventors:

Robert Henry Bond - Plano TX, US
Alan Kramer - Berkeley CA, US
Giovanni Gozzini - Berkeley CA, US

Assignee:

Authentec, Inc. - Melbourne FL

International Classification:

1005

US Classification:

D101041

US Patent:

8378508, Feb 19, 2013

Filed:

Mar 5, 2010

Appl. No.:

12/718880

Inventors:

Robert Henry Bond - Plano TX, US
Alan Kramer - Berkeley CA, US
Giovanni Gozzini - Berkeley CA, US

Assignee:

Authentec, Inc. - Melbourne FL

International Classification:

H01L 23/31

US Classification:

257787, 257E23129, 257688, 382124, 438106, 438127

Abstract:

A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.

US Patent:

8471345, Jun 25, 2013

Filed:

Mar 5, 2010

Appl. No.:

12/718892

Inventors:

Robert Henry Bond - Plano TX, US
Alan Kramer - Berkeley CA, US
Giovanni Gozzini - Berkeley CA, US

Assignee:

Authentec, Inc. - Melbourne FL

International Classification:

H01L 27/14
H01L 23/28
H01L 21/00
G06K 9/00

US Classification:

257414, 257787, 257E23129, 257E21502, 438127, 382126

Abstract:

A biometric sensor assembly comprises a substrate to which is mounted a die containing sensor circuitry, at least one conductive bezel having a visual indicator region formed therein, and electrically connected to said die by way of said substrate, a light source, and a light-directing region directing light from the light source to the visual indicator region. The die, the light-directing region, and the bezel are encased in an encapsulation structure such that a portion of a surface of the die and the visual indication region are exposed or at most thinly covered by the encapsulation structure. The light-directing region directs light emitted by the light source within the encapsulation structure to the visual indicator region. Desired indicia in the visual indicator region may thereby be illuminated, while the die and bezel, and optionally the light source, are protected by the encapsulation structure.

US Patent:

20130076486, Mar 28, 2013

Filed:

Sep 25, 2011

Appl. No.:

13/244559

Inventors:

Robert H. Bond - Plano TX, US
Giovanni Gozzini - Berkeley CA, US

Assignee:

AuthenTec, Inc. - Melbourne FL

International Classification:

G06F 7/04
H01L 23/58

US Classification:

340 583, 29 2501

Abstract:

An electronic device may include a housing and circuitry carried by the housing. The electronic device may also include a finger sensing device carried by the housing and coupled to the circuitry. The finger sensing device may include a mounting substrate, and a semiconductor interposer having a lower surface adjacent the mounting substrate. The finger sensing device may also include a plurality of semiconductor finger sensing die on an upper surface of the semiconductor interposer in side-by-side and abutting relation, and defining a finger sensing surface to receive at least one finger thereon.

US Patent:

56935722, Dec 2, 1997

Filed:

Jan 18, 1996

Appl. No.:

8/588340

Inventors:

Robert H. Bond - Plano TX
Michael J. Hundt - Double Oak TX

Assignee:

SGS-Thomson Microelectronics, Inc. - Carrollton TX

International Classification:

H01L 2160

US Classification:

437209

Abstract:

An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed. An integrated circuit chip is mounted to one side of the slug exposed in the opening. An opposing surface of the slug lies below the plane of the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to a portion of the underside of the substrate not covered by the slug in a ball-grid-array manner, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

Author:

Robert S. Bond

ISBN #:

0674838300

Author:

Robert J. Bond

ISBN #:

0137798776

Author:

Robert J. Bond

ISBN #:

0324141777

Author:

Robert J. Bond

ISBN #:

0324143729

Author:

Robert J. Bond

ISBN #:

0324378343

Author:

Robert J. Bond

ISBN #:

0534950507

Author:

Robert J. Bond

ISBN #:

0471062308

Author:

Robert J. Bond

ISBN #:

0471087637