Richard G Zimmerman

US Patent:

40897338, May 16, 1978

Filed:

Feb 25, 1977

Appl. No.:

5/772205

Inventors:

Richard Henry Zimmerman - Palmyra PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

B44C 122
C03C 1500
C03C 2506
C23F 102

US Classification:

156630

Abstract:

A method is disclosed for forming complex shaped, metal-plastic composite lead frame structures for integrated circuit packaging. The lead frame pattern is formed on a metallic substrate having a profiled plastic member bonded thereto at such location as to hold the complexed shaped metal lead portions in a fixed spaced arrangement. The subject method results in substantial economies in reduced usage of plastics material and yet a high grade product having reliably positioned leads.

US Patent:

40780961, Mar 7, 1978

Filed:

Sep 20, 1976

Appl. No.:

5/724810

Inventors:

John Peter Redmond - Mechanicsburg PA
Albert Shirk - Palmyra PA
Elmer John Bottiglier - Harrisburg PA
Richard Henry Zimmerman - Palmyra PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

C23C 302

US Classification:

427 98

Abstract:

A method is disclosed for the generation of circuit patterns on a polyimide type of substrate by preconditioning the substrate's surface with a hydrazine/caustic solution, depositing a catalyst on the surface treated polymer, and exposing the polymer with the catalyst thereon to a bath having a metal therein capable of deposition electrolessly on the polymer surface containing catalyst.

US Patent:

41992091, Apr 22, 1980

Filed:

Aug 18, 1978

Appl. No.:

5/935042

Inventors:

Gabriel B. Cherian - York PA
William S. Scheingold - Palmyra PA
Richard H. Zimmerman - Palmyra PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H01R 1348

US Classification:

339 59M

Abstract:

The present invention relates to a device for electrically interconnecting two printed circuit boards or the like where the conductive pads are on extremely close spacing. More particularly, the invention includes a plurality of resilient connectors embedded in an elastomeric material with opposing ends thereof being exposed on opposite surfaces of the elastomeric body to provide contact points.

US Patent:

40484386, Sep 13, 1977

Filed:

Nov 18, 1975

Appl. No.:

5/633045

Inventors:

Richard Henry Zimmerman - Palmyra PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H05K 102
H01L 2348

US Classification:

174 685

Abstract:

An improved conductor patterned substrate assembly is disclosed which permits direct attachment of integrated circuit chips to a metallized array while preventing stress buildup due to thermal cycling and/or bonding temperatures. A circuit is formed on a flexible substrate of insulative material which is suitable for withstanding solder, thermal compression bonding, or eutectic die attachment temperatures. The circuit includes a fine line pattern of leads extending up to the edge of a hole in the substrate substantially centered within the pattern of the integrated circuit pad dimensions. The subject assembly can thus be used face down bonding of integrated circuit chips which have bump metallization on the contact pads thereof. Thermal distortion of the substrate during bonding is minimized by the central hole thus preventing undue stresses from being applied to the chip bonds by the substrate. The assembly also provides for full support for the conductor leads throughout their entire length, in order to maintain dimensional and spacial stability especially for bonding larger multi-pad chips.

US Patent:

41432533, Mar 6, 1979

Filed:

Apr 25, 1977

Appl. No.:

5/790635

Inventors:

Richard M. Wagner - Harrisburg PA
Richard H. Zimmerman - Palmyra PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H01H 926
C25D 502
C25D 534

US Classification:

200 5A

Abstract:

Membrane switch assembly comprises a transparent laminate comprised of three sheets of cellulose acetate material. The intermediate sheet has an opening therein which defines a switch site. Hairline conductors on the internal surfaces of the outer sheets cross each other at the switch site so that the switch is closed when one of the outer sheets is pressed at the switch site. The conductors are produced on the surfaces of the outer sheets by a process including electroless deposition of blanket coatings of conductive metal, selective deposition along lines which define the conductors and selective etching of the blanket coating to leave the hairline conductors.

US Patent:

50356283, Jul 30, 1991

Filed:

May 29, 1990

Appl. No.:

7/530042

Inventors:

Albert Casciotti - Hershey PA
Ronald A. Dery - Winston-Salem NC
Richard H. Zimmerman - Bradenton FL

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H01R 909

US Classification:

439 66

Abstract:

An electrical connector (10,50,50',84,84') for being positioned between parallel surfaces and electrically interconnecting conductive areas on the surfaces is disclosed. More particularly, the connector (10,50,50',84,84') includes a housing (12,52,52',86) and contact elements (14,14',14",70,104) which are formed by wrapping a flexible, circuit carrying film (20,72) around a single canted coil spring (18) or by wrapping a flexible circuit carrying film (104) around two spaced apart canted coil springs (18).

Author:

Richard H. Zimmerman

ISBN #:

0792308182

Author:

Richard H. Zimmerman

ISBN #:

0792308190

Author:

Richard H. Zimmerman

ISBN #:

9024733782

Author:

Richard G. Zimmerman

ISBN #:

0873387554

Author:

Richard G. Zimmerman

ISBN #:

0873388526

Author:

Richard Zimmerman

ISBN #:

0452266327