Richard J Edwards

US Patent:

D2547767, Apr 22, 1980

Filed:

Jun 20, 1977

Appl. No.:

5/808249

Inventors:

Richard T. Edwards - Middletown NY

Assignee:

Genpak Corporation - South Glens Falls NY

International Classification:

D0903

US Classification:

D 9183

US Patent:

D2637987, Apr 13, 1982

Filed:

Jun 11, 1979

Appl. No.:

6/047101

Inventors:

Richard T. Edwards - Middletown NY

Assignee:

Genpak Corporation - Middletown NY

International Classification:

D0903

US Classification:

D 9426

US Patent:

40798801, Mar 21, 1978

Filed:

Feb 3, 1977

Appl. No.:

5/765390

Inventors:

Richard Thomas Edwards - Middletown NY

Assignee:

Polysar Plastics, Inc. - Middletown NY

International Classification:

B65D 4500
B65D 4520

US Classification:

229 45R

Abstract:

A plastic food package of base and lid components which have a locking means comprising a locking projection which is stiffened and a locking flap lockingly engagable with the projection. The locking projection in practical constructions is formed by projecting walls which meet to form a peak whereby the projection is stiff. The projection is rigidly held to its component by a stiffening shoulder which supports the projection and itself merges with a sidewall of the component along a junction region which is orientated to prevent movement of projection relative to component. The flap has an aperture and the peak of the projection has to pass through the aperture to lock the flap in a locking position. To effect passage of the peak through the aperture, one of the components needs to be flexed to move the peak into alignment with the aperture. In the locking position, the flap is prevented from returning to an unlocked position because of the peak and the flap lies in the direction of opening of the package to provide greatest resistance to distortion.

US Patent:

53806824, Jan 10, 1995

Filed:

Nov 3, 1993

Appl. No.:

8/147666

Inventors:

Richard C. Edwards - Ringwood NJ
Michael S. Kolesa - Suffern NY
Hiroichi Ishikawa - Mahwah NJ

Assignee:

Materials Research Corporation - Orangeburg NY

International Classification:

H01L 2100
H01L 2102
H01L 21302
H01L 21463

US Classification:

437225

Abstract:

A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.

US Patent:

52598810, Nov 9, 1993

Filed:

May 17, 1991

Appl. No.:

7/701800

Inventors:

Richard C. Edwards - Ringwood NJ
Michael S. Kolesa - Suffern NY
Hiroichi Ishikawa - Mahwah NJ

Assignee:

Materials Research Corporation - Orangeburg NY

International Classification:

H01L 2100
H01L 2102
C23C 1600

US Classification:

118719

Abstract:

A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.