Richard V Ciszek

US Patent:

20140073223, Mar 13, 2014

Filed:

Sep 9, 2013

Appl. No.:

14/022107

Inventors:

Richard Ciszek - Phoenix AZ, US
Clifford Daniel - Tempe A, US

Assignee:

AXUS TECHNOLOGY, LLC - Chandler AZ

International Classification:

H01L 21/02

US Classification:

451 1, 451177, 451 44

Abstract:

A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes. The apparatus includes one or more grind spindles that overlay the turntable and are configured to communicate with the workpieces. The apparatus processes the workpieces by transitioning between first and second operational states. The first operational state centers the spindles and the workpieces thereon under the grind spindle to condition an entire top surface of the workpieces. The second operational state offsets the spindles from the center of the grind spindle to condition a perimeter edge of the workpieces. A controller can govern the transition between first and second operational states.

US Patent:

20120202406, Aug 9, 2012

Filed:

Aug 12, 2011

Appl. No.:

13/208815

Inventors:

Daniel R. Trojan - Phoenix AZ, US
Richard Ciszek - Phoenix AZ, US
Clifford Daniel - Tempe AZ, US

Assignee:

AXUS TECHNOLOGY, LLC - Chandler AZ

International Classification:

B24B 19/00
B24B 1/00

US Classification:

451 57, 451 66

Abstract:

An apparatus for performing both edge trimming and surface grinding includes two spindles for holding two workpieces, a bridge element laterally movable relative to the spindles, and two grinding wheels coupled to the bridge element. The apparatus may be a surface grinding apparatus that includes a system for enabling the surface grinding apparatus to additionally perform edge trimming. A method for processing the workpieces entails placing the two workpieces on the two spindles of the apparatus, directing the bridge element to move laterally to an edge trimming position to trim the outer edge of one workpiece using one of the grinding wheels, to move laterally to another edge trimming position to trim the outer edge of the other workpiece using one of the grinding wheels, and to move laterally to surface grinding positions to perform surface grinding on both of the workpieces using one or both of the grinding wheels.

US Patent:

20190291237, Sep 26, 2019

Filed:

Jun 10, 2019

Appl. No.:

16/436493

Inventors:

- Chandler AZ, US
Richard Ciszek - Phoenix AZ, US
Clifford Daniel - Tempe AZ, US

International Classification:

B24B 37/30
B24B 37/005

Abstract:

A system includes a CMP carrier that includes a resilient flexible membrane upon which a wafer is mounted, at least three ports for supplying air to the resilient flexible membrane to pneumatically pushing on the wafer through pressure applied throughout the surface area of the resilient flexible membrane to have more uniform pressure. Each port provides pressure to different components of the carrier to adjust pressure or vary pressure during processing of the wafer. Further, the system includes a processor and software program for implementing the CMP carrier with existing CMP machines. The software application converts the air pressure applied to the carrier into units that allow the CMP machine to receive expected data and operate in accordance with the existing commands.

US Patent:

20170355062, Dec 14, 2017

Filed:

Jun 7, 2017

Appl. No.:

15/616339

Inventors:

- Chandler AZ, US
Richard Ciszek - Phoenix AZ, US
Clifford Daniel - Tempe AZ, US

International Classification:

B24B 37/30
B24B 37/005

Abstract:

A system includes a CMP carrier that includes a resilient flexible membrane upon which a wafer is mounted, at least three ports for supplying air to the resilient flexible membrane to pneumatically pushing on the wafer through pressure applied throughout the surface area of the resilient flexible membrane to have more uniform pressure. Each port provides pressure to different components of the carrier to adjust pressure or vary pressure during processing of the wafer. Further, the system includes a processor and software program for implementing the CMP carrier with existing CMP machines. The software application converts the air pressure applied to the carrier into units that allow the CMP machine to receive expected data and operate in accordance with the existing commands.