Rehan Choudhary

US Patent:

7615850, Nov 10, 2009

Filed:

Apr 16, 2008

Appl. No.:

12/104103

Inventors:

Rehan Choudhary - Poughkeepsie NY, US
Benjamin V. Fasano - New Windsor NY, US
Sushumna Iruvanti - Wappingers Falls NY, US
Daniel D. Reinhardt - Hinesburg VT, US
Deborah A. Sylvester - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/556

US Classification:

257660, 257778, 257E23115, 257E23193

Abstract:

A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100 C. ). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.

US Patent:

20070212820, Sep 13, 2007

Filed:

Mar 9, 2006

Appl. No.:

11/308167

Inventors:

Rehan Choudhary - Poughkeepsie NY, US
Benjamin Fasano - New Windsor NY, US
Sushumna Iruvanti - Wappingers Falls NY, US
Daniel Reinhardt - Hinesburg VT, US
Deborah Sylvester - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21/00

US Classification:

438118000

Abstract:

A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100 C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.

US Patent:

20080002363, Jan 3, 2008

Filed:

Jun 29, 2006

Appl. No.:

11/427380

Inventors:

Levi Campbell - Poughkeepsie NY, US
Rehan Choudhary - Poughkeepsie NY, US
Michael Ellsworth - Lagrangeville NY, US
Kenneth Marston - Poughquag NY, US
Hilton Toy - Wappingers Falls NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20

US Classification:

361699000

Abstract:

A direct liquid jet impingement module and associated method of providing such used in cooling of electronic components housed in an electronic package is provided. The module comprises a frame having an orifice to be placed over to-be-cooled components. A manifold is then disposed over the frame, such that the manifold opening is aligned with the frame orifice to ultimately enable fluid impingement on the to-be-cooled components. The manifold is formed to receive an inlet for the flow of coolants and an outlet fitting for removal of dissipated heat. A jet orifice plate is also provided inside the manifold opening, aligned with the frame orifice for directing fluid coolant flow over to-be-cooled components.