Raymond C Jodoin

US Patent:

43821561, May 3, 1983

Filed:

Mar 31, 1981

Appl. No.:

6/249642

Inventors:

Raymond C. Jodoin - Scottsdale AZ

Assignee:

Rogers Corporation - Rogers CT

International Classification:

H01B 500

US Classification:

174 72B

Abstract:

A method of production of a miniaturized bus bar is presented wherein a layer of unfired ceramic is positioned between a pair of bus bar conductors.

US Patent:

45846278, Apr 22, 1986

Filed:

Jan 9, 1985

Appl. No.:

6/690117

Inventors:

Donald P. Schilling - Albuquerque NM
Raymond C. Jodoin - Scottsdale AZ
Joseph E. Johnston - Chandler AZ

Assignee:

Rogers Corporation - Rogers CT

International Classification:

H01G 905
H01G 700
H05K 500

US Classification:

361306

Abstract:

A flat decoupling capacitor having incorporated therein a multilayer chip capacitor which provides high capacitance values, local charge storage and noise decoupling for integrated circuits is presented. The decoupling capacitor essentially comprises at least two conductors electrically connected to a multilayer ceramic capacitor chip, all of which are encapsulated by an insulating material. Several embodiments are described having variations in chip dimensions, number of multilayer capacitors, number of conductors and particular structural configuration. A simplified embodiment and method of manufacture thereof is also presented.

US Patent:

45021015, Feb 26, 1985

Filed:

Jul 30, 1982

Appl. No.:

6/403408

Inventors:

Raymond C. Jodoin - Scottsdale AZ

Assignee:

Rogers Corporation - Rogers CT

International Classification:

H05K 720

US Classification:

361386

Abstract:

High frequency noise is decoupled from a bus conductor which supplies power to an integrated circuit by insertion of a metallized ceramic chip in the space defined by the two parallel rows of leads extending from the circuit. The ceramic chip is provided with a pair of rectangular leads, connected to respective of the metalized opposite surfaces thereof, which are respectively connected to the power supply leads of the circuit.

US Patent:

45772584, Mar 18, 1986

Filed:

Nov 29, 1984

Appl. No.:

6/676490

Inventors:

Raymond C. Jodoin - Scottsdale AZ

Assignee:

Rogers Corporation - Rogers CT

International Classification:

H05K 720

US Classification:

361321

Abstract:

High frequency noise is decoupled from a bus conductor which supplies power to an integrated circuit by insertion of a metallized ceramic chip in the space defined by the two parallel rows of leads extending from the circuit. The ceramic chip is provided with a pair of rectangular leads, connected to respective of the metalized opposite surfaces thereof, which are respectively connected to the power supply leads of the circuit.

US Patent:

46226192, Nov 11, 1986

Filed:

Mar 13, 1985

Appl. No.:

6/711478

Inventors:

Donald P. Schilling - Albuquerque NM
Raymond C. Jodoin - Scottsdale AZ
Joseph E. Johnston - Chandler AZ

Assignee:

Rogers Corporation - Rogers CT

International Classification:

H01G 905
H01G 700
H01G 410

US Classification:

361306

Abstract:

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed from a lead frame which contains the four leads of the capacitor (two of which are electrically inactive) on a single plane. The use of a lead frame automatically provides the dimensional tolerances necessary for encapsulation molding of the decoupling capacitor. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a multilayer monolithic ceramic capacitor (for higher capacitance values in combination with other desirable properties such as flat capacitance vs. temperature characteristics), active leads bonded to the capacitor and dummy pins for auto-insertion into printed circuit boards.

US Patent:

46369180, Jan 13, 1987

Filed:

Dec 19, 1984

Appl. No.:

6/683344

Inventors:

Raymond C. Jodoin - Scottsdale AZ

Assignee:

Rogers Corporation - Rogers CT

International Classification:

H05K 118

US Classification:

361405

Abstract:

High frequency noise is decoupled from a bus conductor which supplies power to an integrated circuit by providing a metalized ceramic chip either on top of an integrated circuit or on the back side of a circuit board in direct alignment with an integrated circuit. The ceramic chip is provided with a pair of rectangular leads, connected to respective of the metalized opposite surfaces thereof, which are respectively connected to the power supply leads of the integrated circuit.