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Pierre-Alexandre Girard

age ~48

from Apopka, FL

Also known as:
  • Pierre-Alexandr Girard

Pierre-Alexandre Girard Phones & Addresses

  • Apopka, FL

Us Patents

  • High Reliability Wafer Level Package And Manufacturing Method

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  • US Patent:
    20130087379, Apr 11, 2013
  • Filed:
    Oct 10, 2011
  • Appl. No.:
    13/270152
  • Inventors:
    George Grama - Sanford FL, US
    Christophe Zinck - Grenoble, FR
    Pierre-Alexandre Girard - Apopka FL, US
    Charles E. Carpenter - Orlando FL, US
  • Assignee:
    TRIQUINT SEMICONDUCTOR, INC. - Hillsboro OR
  • International Classification:
    H05K 5/00
    H05K 13/00
  • US Classification:
    174546, 295921
  • Abstract:
    Disclosed embodiments include a package having an electronic device disposed within a cavity formed by an enclosure that includes a sharp portion. The package may further include a photosensitive layer applied over the enclosure to provide a smooth portion that is adjacent to the sharp portion. Methods for manufacturing the package are also described. Other embodiments may be described and claimed.

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