Abstract:
Temperature uniformity and control in apparatus for chemical vapor deposition of diamond is improved by contacting the rear of the substrate assembly, which may be a substrate or a holder containing substrates, with a thermal spreader, preferably of copper and preferably having heating means embedded therein or associated therewith. The thermal spreader contacts a thermal resistance unit, preferably of stainless steel, which in turn is in contact with a cooling element that preferably has coolant passages therein.