Perry W Kaminski

US Patent:

7305264, Dec 4, 2007

Filed:

Nov 22, 2004

Appl. No.:

10/994421

Inventors:

Eugene A. Larson - Lummi Island WA,
Perry W. Kaminski - Stehekin WA,
Yu-Chi Chu - Brier WA,

Assignee:

UST, Inc. - Everett WA

International Classification:

A61B 6/00

US Classification:

600427, 600439, 600459, 601 2

Abstract:

Noninvasive pain treatment of skeletal cancer metastases in cancer patients utilizing planar or focused ultrasound. The ultrasound energy preferably targets at the Periosteum or immediate soft-bone-tissue interface, where local sensory pain receptors are directly affected by the growing tumor, to generate heat to destroy local sensory pain receptors so as to interrupt or block the pain feedback pathway to the central nervous system.

US Patent:

7378779, May 27, 2008

Filed:

Jul 20, 2006

Appl. No.:

11/458991

Inventors:

Perry Kaminski - Stehekin WA,
Yu-Chi Chu - Brier WA,

Assignee:

UST, Inc. - Seattle WA

International Classification:

H01L 41/04
G01N 29/00

US Classification:

310334, 310322, 29 2535

Abstract:

A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.

US Patent:

7405510, Jul 29, 2008

Filed:

Jul 20, 2006

Appl. No.:

11/458978

Inventors:

Perry Kaminski - Stehekin WA,
Yu-Chi Chu - Brier WA,

Assignee:

UST, Inc. - Seattle WA

International Classification:

H01L 41/08

US Classification:

310334, 310366

Abstract:

A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.

US Patent:

7902728, Mar 8, 2011

Filed:

Jun 27, 2008

Appl. No.:

12/163196

Inventors:

Perry Kaminski - Stehekin WA,
Yu-Chi Chu - Brier WA,

Assignee:

UST, Inc. - Seattle WA

International Classification:

H01L 41/083

US Classification:

310346, 310322, 310334, 310366

Abstract:

A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.

US Patent:

8237335, Aug 7, 2012

Filed:

Jul 20, 2006

Appl. No.:

11/458994

Inventors:

Perry Kaminski - Stehekin WA,
Yu-Chi Chu - Brier WA,

Assignee:

UST, Inc. - Redmond WA

International Classification:

H01L 41/08

US Classification:

310334, 310366

Abstract:

A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.

US Patent:

8446071, May 21, 2013

Filed:

Jul 20, 2006

Appl. No.:

11/458973

Inventors:

Perry Kaminski - Stehekin WA,
Yu-Chi Chu - Brier WA,

Assignee:

UST, Inc. - Redmond WA

International Classification:

H01L 41/08

US Classification:

310334, 310366

Abstract:

A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.

US Patent:

2002004, Apr 25, 2002

Filed:

Dec 17, 2001

Appl. No.:

10/023097

Inventors:

John Swanson - Portland OR,
Richard Sass - Portland OR,
Jerome Boogaard - Forest Grove OR,
David Sahn - Oswego OR,
Perry Kaminski - Stehekin WA,

International Classification:

A61B008/02

US Classification:

600/450000

Abstract:

An ultrasound probe assembly adapted for bio-imaging. The assembly comprises a catheter, an electrical assembly, including a set of linear conductors, at least partially housed within said catheter. An ultrasound transceiving unit is electrically connected to said electrical assembly and can be placed in both an undeployed state in which the transceiving unit is oriented coincidentally to said catheter and a deployed state in which it is directed to provide imaging signals over a volume of interest.

US Patent:

2005008, Apr 14, 2005

Filed:

Aug 19, 2004

Appl. No.:

10/921715

Inventors:

Eugene Larson - Lummi Island WA,
Perry Kaminski - Stehekin WA,

International Classification:

A61F002/00

US Classification:

607101000

Abstract:

A noninvasive or minimally invasive treatment of cardiac arrhythmia such as supraventricular and ventricular arrhythmias, specifically atrial fibrillation and ventricular tachycardia, by treating the tissue with heat produced by ultrasound, (including High Intensity Focused Ultrasound or HIFU) intended to have a biological and/or therapeutic effect, so as to interrupt or remodel the electrical substrate in the tissue area that supports arrhythmia.