Nicole Hablutzel

US Patent:

20050035446, Feb 17, 2005

Filed:

Sep 28, 2004

Appl. No.:

10/952424

Inventors:

Maurice Karpman - Brookline MA, US
Nicole Hablutzel - Cambridge MA, US
Peter Farrell - Lunenburg MA, US
Michael Judy - Wakefield MA, US
Lawrence Felton - Hopkinton MA, US
Lewis Long - Woburn MA, US

International Classification:

H01L023/06

US Classification:

257711000, 257733000, 257710000, 257669000

Abstract:

A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.

US Patent:

20050056870, Mar 17, 2005

Filed:

Sep 28, 2004

Appl. No.:

10/952330

Inventors:

Maurice Karpman - Brookline MA, US
Nicole Hablutzel - Cambridge MA, US
Peter Farrell - Lunenburg MA, US
Michael Judy - Wakefield MA, US
Lawrence Felton - Hopkinton MA, US

International Classification:

H01L023/48

US Classification:

257222000

Abstract:

A packaged microchip has a microchip attach region with a lower modulus of elasticity than other portions of the package base. Specifically, the packaged microchip includes a stress sensitive microchip, and a package having a base with a primary region and an attach region. A surface of the microchip is coupled to the attach region of the package. The attach region has a modulus of elasticity that is less than the modulus of elasticity of the primary region.