Michael Ehlert

US Patent:

50649680, Nov 12, 1991

Filed:

Jan 16, 1990

Appl. No.:

7/465851

Inventors:

Alan L. Kovacs - Long Beach CA
Michael R. Ehlert - Irvine CA
Helen Congleton - Huntington Beach CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

H01L 2302

US Classification:

174 524

Abstract:

An integrated circuit package includes a rectangular base, and a continuous sidewall which extends upwardly from the periphery of the base. Microelectronic circuit components are mounted on the base in a cavity defined within the sidewall. A domed lid includes a resilient central domed portion which arches above the cavity. A peripheral edge portion of the lid extends downwardly into the cavity by a small distance, adjacent to the inner surface of the sidewall. A lip extends outwardly from the edge portion and is sealingly welded at its periphery to the upper surface of the sidewall. The joint between the lip and edge portion is resilient and acts as a hinge, such that when a force or pressure is applied to the domed portion, the edge portion rotates about the hinge into abutment with the inner surface of the sidewall. This transfers a major component of the applied force to the sidewall, and resists deflection of the domed portion into the cavity.