Michiko Shimada

US Patent:

20060289887, Dec 28, 2006

Filed:

Jun 24, 2005

Appl. No.:

11/165900

Inventors:

Thong Bui - Pinellas Park FL, US
Michiko Shimada - Tampa FL, US
Israel Morejon - Tampa FL, US
Waleed Rusheidat - Odessa FL, US
Paul Neathway - Tierra Verde FL, US

International Classification:

H01L 33/00

US Classification:

257099000

Abstract:

A high performance LED () and associated semiconductor package () advantageously utilizes an integrated heat sink () for purposes of power dissipation. At a next level of assembly, () the semiconductor package () is electromechanically coupled to a printed circuit board (). The printed circuit board () has a cavity () with thermal contact pad () disposed therein and connected to a metal back plane (). During electromechanical coupling, the heat sink () is thermally coupled to the metal back plane () via the thermal contact pad (). During operation, the thermal coupling of the heat sink () to the metal back plane, also referred to as a thermal mass reservoir () operates to increase the effective thermal mass of the integrated heat sink () and thereby provide enhanced power dissipation and heat transfer away from the high performance LED device ().