Michael J Bettinger

US Patent:

6357275, Mar 19, 2002

Filed:

Nov 21, 2000

Appl. No.:

09/721028

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Eagle ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B21D 2202

US Classification:

72414, 29827

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6398043, Jun 4, 2002

Filed:

Jun 4, 2001

Appl. No.:

09/873834

Inventors:

James M. Wark - Boise ID
Michael J. Bettinger - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

A47G 1908

US Classification:

211 4117, 269 47, 269 69, 269305, 269903, 361752

Abstract:

A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.

US Patent:

6439450, Aug 27, 2002

Filed:

Aug 27, 2001

Appl. No.:

09/940203

Inventors:

Gregory M. Chapman - Meridian ID
Michael J. Bettinger - Eagle ID
Jennifer A. Due - Meridian ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 3700

US Classification:

2281805, 228 45

Abstract:

An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

US Patent:

6454153, Sep 24, 2002

Filed:

Mar 2, 2001

Appl. No.:

09/797725

Inventors:

Michael Bettinger - Eagle ID
Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 3704

US Classification:

228 45, 228 151

Abstract:

The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip. The apparatus further comprises a pressing tool movably mounted relative to the substrate, and which has a deflecting surface configured to press the wires into a slit of the substrate when the pressing tool is moved toward the substrate.

US Patent:

6474532, Nov 5, 2002

Filed:

Mar 2, 2001

Appl. No.:

09/797790

Inventors:

Michael Bettinger - Eagle ID
Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 106

US Classification:

2281101, 2281735

Abstract:

The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip. The apparatus further comprises a pressing tool movably mounted relative to the substrate, and which has a deflecting surface configured to press the wires into a slit of the substrate when the pressing tool is moved toward the substrate.

US Patent:

6504257, Jan 7, 2003

Filed:

Nov 21, 2000

Appl. No.:

09/718597

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Eagle ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 2940

US Classification:

257782, 257786, 257666

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6509205, Jan 21, 2003

Filed:

Apr 3, 2001

Appl. No.:

09/825656

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 2144

US Classification:

438106, 438611

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6595406, Jul 22, 2003

Filed:

May 23, 2002

Appl. No.:

10/155317

Inventors:

Gregory M. Chapman - Meridian ID
Michael J. Bettinger - Eagle ID
Jennifer A. Due - Meridian ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 3102

US Classification:

2281805, 228 45, 228 11

Abstract:

An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.