Matthew J King

Author:

Matthew King

ISBN #:

0787948659

Author:

Matthew A. King

ISBN #:

0662279514

Author:

Matthew J. King

ISBN #:

0080444288

US Patent:

20220352467, Nov 3, 2022

Filed:

Apr 26, 2022

Appl. No.:

17/729465

Inventors:

- Ewing NJ, US
Craig Anthony OUTTEN - Rydal PA, US
Gregory MCGRAW - Yardley PA, US
Matthew KING - Moorestown NJ, US
Xin XU - Plainsboro NJ, US

International Classification:

H01L 51/00
C23C 14/12
C23C 14/22
C23C 16/44

Abstract:

Organic vapor jet printing (OVJP) devices and techniques are provided that use a solid materials sublimation source to provide material for deposition on a substrate. Carrier gas from a carrier gas source entrains vapor from the solid material within each sublimation source for transport to a print head within a deposition chamber. The sublimation source includes a sufficiently long internal flow path to achieve an acceptable level of material saturation of the carrier gas.

US Patent:

20210367217, Nov 25, 2021

Filed:

Aug 5, 2021

Appl. No.:

17/394769

Inventors:

- Ewing NJ, US
Jason PAYNTER - Bristol PA, US
Gregory MCGRAW - Yardley PA, US
Matthew KING - Moorestown NJ, US

International Classification:

H01L 51/56
H01L 51/52
H01L 51/00

Abstract:

Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.

US Patent:

20210355575, Nov 18, 2021

Filed:

Jul 30, 2021

Appl. No.:

17/389694

Inventors:

- Ewing NJ, US
Gregory MCGRAW - Yardley PA, US
Matthew KING - Moorestown NJ, US
Gregg KOTTAS - Ewing NJ, US

International Classification:

C23C 14/22
C23C 14/12
C23C 14/24

Abstract:

Embodiments of the disclosed subject matter provide a vapor distribution manifold that ejects organic vapor laden gas into a chamber and withdraws chamber gas, where vapor ejected from the manifold is incident on, and condenses onto, a deposition surface within the chamber that moves relative to one or more print heads in a direction orthogonal to a platen normal and a linear extent of the manifold. The volumetric flow of gas withdrawn by the manifold from the chamber may be greater than the volumetric flow of gas injected into the chamber by the manifold. The net outflow of gas from the chamber through the manifold may prevent organic vapor from diffusing beyond the extent of the gap between the manifold and deposition surface. The manifold may be configured so that long axes of delivery and exhaust apertures are perpendicular to a print direction.

US Patent:

20200303536, Sep 24, 2020

Filed:

Mar 21, 2019

Appl. No.:

16/360828

Inventors:

JOSEPHINE BEA CHANG - Ellicott City MD, US
ROBERT S. HOWELL - Silver Spring MD, US
MATTHEW R. KING - Wake Forest NC, US

Assignee:

NORTHROP GRUMMAN SYSTEMS CORPORATION - FALLS CHURCH VA

International Classification:

H01L 29/778
H01L 29/15
H01L 29/08
H01L 29/66
H01L 21/02

Abstract:

A vertical transistor is provided that includes a base structure and a superlattice structure overlying the base structure. The superlattice structure comprises a multichannel ridge having sidewalls. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge. The vertical transistor also includes a source region that overlies the base structure and is in contact with a first end of the superlattice structure, a floating drain that overlies the base structure and is in contact with a second end of the superlattice structure, and a drain. When the vertical transistor is in an ‘ON’ state, current flows from the source region through the channels of the multichannel ridge to the floating drain, which funnels the current to the drain through at least a portion of the base structure.

US Patent:

20200013775, Jan 9, 2020

Filed:

Sep 20, 2019

Appl. No.:

16/577629

Inventors:

JUSTIN ANDREW PARKE - ELLICOTT CITY MD, US
ERIC J. STEWART - SILVER SPRING MD, US
ROBERT S. HOWELL - SILVER SPRING MD, US
HOWELL GEORGE HENRY - ELLICOTT CITY MD, US
BETTINA NECHAY - LAUREL MD, US
HARLAN CARL CRAMER - COLUMBIA MD, US
MATTHEW RUSSELL KING - LINTHICUM MD, US
SHALINI GUPTA - Baltimore MD, US
RONALD G. FREITAG - Catonsville MD, US
KAREN MARIE RENALDO - Pasadena CA, US

Assignee:

NORTHROP GRUMMAN SYSTEMS CORPORATION - FALLS CHURCH VA

International Classification:

H01L 27/088
H01L 21/8252
H01L 21/308

Abstract:

A method of forming an integrated circuit can include forming a heterostructure over a substrate structure, wherein the given substrate structure comprises a given semiconductor material. The method can include etching a castellated channel region in an e-mode device area of the heterostructure that defines a plurality of ridge channels interleaved between a plurality of trenches, the ridge channels comprising another semiconductor material. The method can also include forming an isolation region on the heterostructure to electrically isolate the e-mode device area from a d-mode device area of the heterostructure. The method can further include forming a mask with an opening that defines a castellated gate opening overlying the castellated channel region and the mask defines an opening overlaying a single planar gate overlying the d-mode device area of the heterostructure. The method can also include performing a contact fill with conductive material to form a castellated gate contact.

US Patent:

20190256968, Aug 22, 2019

Filed:

Jan 23, 2019

Appl. No.:

16/255040

Inventors:

- Ewing NJ, US
Gregory MCGRAW - Yardley PA, US
Matthew KING - Moorestown NJ, US
Gregg KOTTAS - Ewing NJ, US

International Classification:

C23C 14/22
C23C 14/12
C23C 14/24

Abstract:

Embodiments of the disclosed subject matter provide a vapor distribution manifold that ejects organic vapor laden gas into a chamber and withdraws chamber gas, where vapor ejected from the manifold is incident on, and condenses onto, a deposition surface within the chamber that moves relative to one or more print heads in a direction orthogonal to a platen normal and a linear extent of the manifold. The volumetric flow of gas withdrawn by the manifold from the chamber may be greater than the volumetric flow of gas injected into the chamber by the manifold. The net outflow of gas from the chamber through the manifold may prevent organic vapor from diffusing beyond the extent of the gap between the manifold and deposition surface. The manifold may be configured so that long axes of delivery and exhaust apertures are perpendicular to a print direction.

US Patent:

20190217610, Jul 18, 2019

Filed:

Jan 9, 2019

Appl. No.:

16/243393

Inventors:

- Ewing NJ, US
Matthew KING - Evesham NJ, US
William E. QUINN - Whitehouse Station NJ, US

International Classification:

B41J 2/14
B05B 1/16
B41J 2/16

Abstract:

Embodiments of the disclosed subject matter provide a micronozzle array formed from monolithic silicon. The micronozzle array may have a plurality of nozzles, where each nozzle of the plurality of nozzles including an integrated plug valve that allows flow from the nozzle to be attenuated separately from each other nozzle of the plurality of nozzles. Each of the plurality of nozzles may include a microchannel, formed from the monolithic silicon, having a first channel portion and a second channel portion, where the first channel portion is narrower than the second channel portion, and where the first channel portion forms an aperture of the nozzle that is configured to eject vapor from the microchannel. Each of the plurality of nozzles may include a stem, formed from the monolithic silicon that includes the integrated plug valve is suspended in the microchannel to attenuate the flow from the nozzle.

US Patent:

20190214603, Jul 11, 2019

Filed:

Jan 11, 2019

Appl. No.:

16/245517

Inventors:

- Ewing NJ, US
Jason PAYNTER - Bristol PA, US
Gregory MCGRAW - Yardley PA, US
Matthew KING - Evesham NJ, US

International Classification:

H01L 51/56
H01L 51/52
H01L 51/00

Abstract:

Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.