Matthew D Heydinger from Cupertino, CA, age 60

Passively Aligned Fiber Optical Engine For Parallel Optics Interconnect Devices
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US Patent:

6754406, Jun 22, 2004
Filed:

Jan 22, 2002
Appl. No.:

10/056099
Inventors:

Ronald Kaneshiro - Los Altos CA
Y Man Teng - Saratoga CA
Matthew Heydinger - Menlo Park CA
Assignee:

Agilent Technologies, Inc. - Palo Alto CA
International Classification:

G02B 612
US Classification:

385 14, 385 52, 385 88, 385 90, 385 91, 438 29
Abstract:

A fiber optical engine and manufacturing method therefor is provided with an optical element having an optical substrate and optics. An opto-electronic element, which converts between light and electronic signals, is secured to the optical substrate and is passively aligned with the optics. A integrated circuit for controlling the opto-electronic element is secured to the optical substrate. An electrical substrate is secured to the optical element.

Method Of Making Solder Balls By Contained Paste Deposition
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US Patent:

56725426, Sep 30, 1997
Filed:

Mar 19, 1996
Appl. No.:

8/618226
Inventors:

Matthew K. Schwiebert - Palo Alto CA
Donald T. Campbell - Campbell CA
Matthew Heydinger - Sunnyvale CA
Robert E. Kraft - Santa Clara CA
Hubert A. Vander Plas - Palo Alto CA
Assignee:

Hewlett Packard Company - Palo Alto CA
International Classification:

H01L 2144
US Classification:

437183
Abstract:

A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Method Of Making Solder Balls By Contained Paste Deposition
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US Patent:

55867154, Dec 24, 1996
Filed:

Mar 19, 1996
Appl. No.:

8/617585
Inventors:

Matthew K. Schwiebert - Palo Alto CA
Donald T. Campbell - Campbell CA
Matthew Heydinger - Sunnyvale CA
Robert E. Kraft - Santa Clara CA
Hubert A. Vander Plas - Palo Alto CA
Assignee:

Hewlett-Packard Company - Palo Alto CA
International Classification:

H01L 2160
H05K 334
US Classification:

2282481
Abstract:

A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Method Of Bumping Substrates By Contained Paste Deposition
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US Patent:

55391532, Jul 23, 1996
Filed:

Aug 8, 1994
Appl. No.:

8/287453
Inventors:

Matthew K. Schwiebert - Palo Alto CA
Donald T. Campbell - Campbell CA
Matthew Heydinger - Mountain View CA
Robert E. Kraft - Santa Clara CA
Hubert A. Vander Plas - Palo Alto CA
Assignee:

Hewlett-Packard Company - Palo Alto CA
International Classification:

H05K 118
US Classification:

174260
Abstract:

A solder bump is stenciled into a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Method Of Bumping Substrates By Contained Paste Deposition
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US Patent:

58800174, Mar 9, 1999
Filed:

Aug 25, 1997
Appl. No.:

8/920221
Inventors:

Matthew K. Schwiebert - Palo Alto CA
Donald T. Campbell - Campbell CA
Matthew Heydinger - Sunnyvale CA
Robert E. Kraft - Santa Clara CA
Hubert A. Vander Plas - Palo Alto CA
Assignee:

Hewlett-Packard Co. - Palo Alto CA
International Classification:

H01L 2144
US Classification:

438613
Abstract:

A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.