Matthew G Abercrombie

US Patent:

20060283007, Dec 21, 2006

Filed:

Aug 16, 2005

Appl. No.:

11/204812

Inventors:

Florent Cros - Decatur GA, US
David O'Brien - Atlanta GA, US
Michael Fonseca - Marietta GA, US
Matthew Abercrombie - Marietta GA, US
Jin Park - Suwanee GA, US
Angad Singh - Marietta GA, US

International Classification:

H01F 7/06
H01G 7/00
B23K 26/16

US Classification:

029602100, 029025410, 205122000, 219121670

Abstract:

A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.

US Patent:

20100058583, Mar 11, 2010

Filed:

Nov 4, 2009

Appl. No.:

12/612070

Inventors:

Florent Cros - Decatur GA, US
David O'Brien - Atlanta GA, US
Michael Fonseca - Marietta GA, US
Matthew Abercrombie - Marietta GA, US
Jin Woo Park - Suwanee GA, US
Angad Singh - Marietta GA, US

International Classification:

H01R 43/00
H05K 1/16
H01L 21/20

US Classification:

29825, 438393, 257E2109

Abstract:

A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.

US Patent:

20210369123, Dec 2, 2021

Filed:

Aug 13, 2021

Appl. No.:

17/401365

Inventors:

David O'Brien - Atlanta GA, US
Michael Fonseca - Marietta GA, US
Matthew Abercrombie - Marietta GA, US
Jin Woo Park - Suwanee GA, US
Angad Singh - Marietta GA, US

International Classification:

A61B 5/0215
H05K 3/32
A61B 5/0205
A61B 5/00

Abstract:

A system and method are provided to deploy an implant assembly in a vessel. The implant assembly comprises a pressure sensor having a body, and first and second anchoring members coupled to the body of the pressure sensor. A delivery apparatus comprises a shaft having proximal and distal ends, the shaft including a main lumen and a secondary lumen, the main lumen extending along at least a portion of the shaft. The secondary lumen extends along at least a portion of the length of the shaft, the secondary lumen joined with first and second ports provided in a sidewall of the shaft. A tether wire is configured to be slidably positioned within the secondary lumen, the tether wire having a distal portion configured to secure the implant assembly against the sidewall.

US Patent:

20190099087, Apr 4, 2019

Filed:

Nov 16, 2018

Appl. No.:

16/194103

Inventors:

David O'Brien - Atlanta GA, US
Michael Fonseca - Marietta GA, US
Matthew Abercrombie - Marietta GA, US
Jin Woo Park - Suwanee GA, US
Angad Singh - Marietta GA, US

International Classification:

A61B 5/0215
A61B 5/00
A61B 5/0205
H05K 3/32
A61N 1/365

Abstract:

A pressure sensor comprises an upper wafer formed from a dielectric material, the upper wafer having one or more channels. The upper wafer includes a first capacitor plate and a second capacitor plate formed on a lower surface of the upper wafer. According to one embodiment the sensor further comprises an inductor formed from one or more windings of a conductive material, the inductor being contained within the one or more channels in the upper wafer in fixed relation to the first and second capacitor plates, the inductor comprising first and second inductor leads, the first lead being electrically coupled to the first capacitor plate and the second lead electrically coupled to the second capacitor plate. The apparatus further comprises a lower wafer formed from the dielectric material, the lower wafer being thinner than the upper wafer and a third capacitor plate formed on an inner surface of the lower wafer, the upper and lower wafers being fused together to form a monolithic housing such that the first and second capacitor plates are arranged in parallel, spaced-apart relation from the third capacitor plate, a portion of the lower wafer comprising a pressure sensitive deflective region underlying at least a portion of the third capacitor plate, whereby the deflective region deflects in response to changes in ambient pressure in the medium.

US Patent:

20150342470, Dec 3, 2015

Filed:

Jun 8, 2015

Appl. No.:

14/733450

Inventors:

- Grand Duchy of Luxembourg, LU
DAVID O'BRIEN - Atlanta GA, US
MICHAEL FONSECA - Marietta GA, US
MATTHEW ABERCROMBIE - Marietta GA, US
JIN WOO PARK - Suwanee GA, US
ANGAD SINGH - Marietta GA, US

International Classification:

A61B 5/0215
A61B 5/0205
H05K 3/32

Abstract:

A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.