Mary Prokop

US Patent:

52433200, Sep 7, 1993

Filed:

Aug 26, 1991

Appl. No.:

7/750070

Inventors:

Sidney J. Clouser - Chardon OH
Chinho Lee - Lyndhurst OH
Mary K. Prokop - Cleveland Heights OH

Assignee:

Gould Inc. - Eastlake OH

International Classification:

H01C 1012

US Classification:

338308

Abstract:

Electrodeposited planar resistive layers are disclosed, which may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive. Planar resistors may be produced which have sheet resistances in the range of from about 15 to about 1000. OMEGA. per square.

US Patent:

61717142, Jan 9, 2001

Filed:

Apr 3, 1997

Appl. No.:

8/832097

Inventors:

Nicholas E. Bergkessel - Mentor OH
Tad Bergstresser - Shaker Heights OH
Mary K. Prokop - Cleveland Heights OH
David B. Russell - Cleveland OH

Assignee:

Gould Electronics Inc. - Eastlake OH

International Classification:

B32B 1508

US Classification:

428618

Abstract:

This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).