Mario E Ecker

US Patent:

51557860, Oct 13, 1992

Filed:

Apr 29, 1991

Appl. No.:

7/693996

Inventors:

Mario E. Ecker - Poughkeepsie NY
Lawrence Jacobowitz - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 630
H01L 3902

US Classification:

385 94

Abstract:

The present invention relates generally to a new interface and a method for making the same, and more particularly, to an optical fiber interface and a method for making the same. On a substrate having semiconductors, a receiver/transmitter connection is provided to interface with an optical fiber. Integral means for the fiber alignment, support and transit through a sealed environment is also provided. The substrate having the receiver/transmitter secured to it with the optical fiber end, is then enclosed in a housing.

US Patent:

54396360, Aug 8, 1995

Filed:

Feb 18, 1992

Appl. No.:

7/836675

Inventors:

Raschid J. Bezama - Mahopac NY
Jon A. Casey - LaGrange NY
Mario E. Ecker - Poughkeepsie NY
Shaji Farooq - Hopewell Junction NY
Irene S. Frantz - Leeds NY
Katharine G. Frase - Peekskill NY
David H. Gabriels - Cold Springs NY
Lester W. Herron - Hopewell Junction NY
John U. Knickerbocker - Hopewell Junction NY
Sara H. Knickerbocker - Hopewell Junction NY
Govindarajan Natarajan - Pleasant Valley NY
John Thomson - Lake Carmel NY
Yee-Ming Ting - Cornwall NY
Sharon L. Tracy - LaGrangeville NY
Robert M. Troncillito - Marlboro NY
Vivek M. Sura - Hopewell Junction NY
Donald R. Wall - Wappingers Falls NY
Giai V. Yen - Seattle WA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B22F 300

US Classification:

419 3

Abstract:

A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

US Patent:

53332253, Jul 26, 1994

Filed:

Aug 3, 1993

Appl. No.:

8/101119

Inventors:

Lawrence Jacobowitz - Poughkeepsie NY
Mario E. Ecker - Poughkeepsie NY
Casimer M. DeCusatis - Lake Katrine NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 600
G02B 636

US Classification:

385 93

Abstract:

Obtains a large increase in the number of fiber optic inputs/output (I/O) lines connectable to a module by enabling edge connection of multiple clusters of optical fibers to be connected around a module. Each connector connects a cluster of optical fibers in a small dimension of space on the module. Many distinct pluggable connectors may be provided along one or more edges of a module. The optical-fiber cluster connectors are embedded in indentations around the edges of a multilayer glass/ceramic (MLGC) multi-chip module (MCM), which may be a thermal conduction module (TCM), containing an integrated photonic receiver and/or transmitter for each fiber. Each connector supports a large number of fibers from a single cable, and a large number of connectors may be provided in a single module. Easy plugging and unplugging is obtained for each connector without interferring with any existing cooling apparatus or I/O pins of the module. Receptacle and plug assemblies which hold the fibers in respective key V-grooves etched in silicon members which carry and interlock each fiber in each receptacle.

US Patent:

43773168, Mar 22, 1983

Filed:

Feb 27, 1981

Appl. No.:

6/238873

Inventors:

Mario E. Ecker - Poughkeepsie NY
Leonard T. Olson - Jericho VT

Assignee:

International Business Machines Corporation - Hopewell Junction NY

International Classification:

H05K 118

US Classification:

339 17CF

Abstract:

A system for connecting a semiconductor chip carrier to a printed circuit card is described. The semiconductor chip carrier has a flexible, extendable wiring membrane attached to the bottom thereof which extends beyond the periphery of the semiconductor chip carrier and in the area beyond the periphery is provided with electrical contacts. The electrical contacts are mated to complementary contacts in a printed circuit card which is biased from the semiconductor chip carrier by electrical and thermal contact means. The membrane, inter alia, provides high density electrical contact between the semiconductor and printed circuit card. Various elements thereof and a process for forming the same are described.

US Patent:

53373880, Aug 9, 1994

Filed:

Aug 3, 1993

Appl. No.:

8/101118

Inventors:

Lawrence Jacobowitz - Poughkeepsie NY
Mario E. Ecker - Poughkeepsie NY
Casimer M. DeCusatis - Lake Katrine NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 636

US Classification:

385 76

Abstract:

A matrix of cluster connectors for switching and interconnecting large numbers of optical fiber and/or electrical conductors (such as coaxial lines) to a module used in computers, communications and related applications. The matrix of pluggable cluster connector receptacles is located on a major surface of a module, such as a ceramic multi-chip module or a thin film silicon chip carrier module. A semiconductor wafer is fabricated with a matrix of angled slots fabricated to form the matrix of receptacles. The wafer is a major surface of the module, and may have another opening for chips fastened to the module surface below the wafer. Each angled slot engages an end of a plug member to align any optical fiber ends contained in the cluster held by the plug with a corresponding lens/light signal transducer in the module. Instead, a light transducer may be contained in the plug to provide electrical signals to a contact of the plug mating with a contact deposited on the wall of the engaged slot, which also engage contacts connected to coaxial lines in the cluster.

US Patent:

53049691, Apr 19, 1994

Filed:

Sep 25, 1992

Appl. No.:

7/951741

Inventors:

Lawrence Jacobowitz - Poughkeepsie NY
Mario E. Ecker - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01P 100
H01P 306

US Classification:

333260

Abstract:

A new interface and a method for making the same, and more particularly, an electrical transmission-line interface and a method for making the same. On a substrate having semiconductors, a driver or receiver circuit is provided to interface with an electrical transmission-line. Integral means for the electrical transmission-line alignment, support and transit through a sealed environment is also provided. A fluid tight seal can also be provided for the various components that are in the interior of the housing. Variable time-delay means is provided for a computer clock system or other microwave applications.

US Patent:

45492000, Oct 22, 1985

Filed:

Jul 8, 1982

Appl. No.:

6/396204

Inventors:

Mario E. Ecker - Poughkeepsie NY
Leonard T. Olson - Poyntelle PA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2712

US Classification:

357 80

Abstract:

A multi-level integrated circuit packaging system having a primary support frame, an array of secondary support frames mounted in said primary support frame and an array of single chip carriers associated with each secondary support frame. An integrated circuit is encapsulated in each single chip carrier, which may be a variety of carrier types which has an insulated wiring pattern with EC wells and delete lands. The secondary and primary support frames also have EC pads so that a change capability exists to any electrical signal path terminating on the chip.

US Patent:

51736683, Dec 22, 1992

Filed:

Apr 29, 1991

Appl. No.:

7/693971

Inventors:

Lawrence Jacobowitz - Poughkeepsie NY
Mario E. Ecker - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01P 118

US Classification:

333156

Abstract:

The present invention relates generally to a new interface and a method for making the same, and more particularly, to an electrical transmission-line interface and a method for making the same. On a substrate having semiconductors, a driver or receiver circuit is provided to interface with an electrical transmission-line. Integral means for the electrical transmission-line alignment, support and transit through a sealed environment is also provided. A fluid tight seal can also be provided for the various components that are in the interior of the housing. Variable time-delay means is provided for a computer clock system or other microwave applications.