Marco Antonio Sosa

US Patent:

7672546, Mar 2, 2010

Filed:

Jun 22, 2007

Appl. No.:

11/767311

Inventors:

David F. Welch - Menlo Park CA, US
Vincent G. Dominic - Dayton OH, US
Mark J. Missey - San Jose CA, US
Radhakrishnan L. Nagarajan - Cupertino CA, US
Atul Mathur - Santa Clara CA, US
Frank H. Peters - Cork, IE
Richard P. Schneider - Mountain View CA, US
Charles H. Joyner - Sunnyvale CA, US
Jonas Webjorn - Redwood City CA, US
Marco E. Sosa - San Jose CA, US

Assignee:

Infinera Corporation - Sunnyvale CA

International Classification:

G02B 6/12

US Classification:

385 14, 398 91, 372 26, 372 32

Abstract:

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

US Patent:

7716560, May 11, 2010

Filed:

Jun 30, 2006

Appl. No.:

11/479047

Inventors:

Edward E. Sprague - Woodside CA, US
Marco E. Sosa - San Jose CA, US
Daniel P. Murphy - Ben Lomond CA, US
Christopher C. Liou - Cupertino CA, US
Drew D. Perkins - Saratoga CA, US

Assignee:

Infinera Corporation - Sunnyvale CA

International Classification:

H03M 13/00

US Classification:

714776

Abstract:

The present invention provides a system, apparatus and method for accurately identifying optical or digital impairments on a span using FEC errors identified at an intermediary node. This information may be provided to an end node within a network to switch to a redundant path around the impaired optical path or span therein. In one embodiment of the invention, signal degradation is identified by analyzing FEC data within a FEC decoded signal at an intermediary node. An identification of signal degradation provides an indication of a potential failing span within an optical link, which may be provided in-band or out-of-band to a terminal node so that a signal may be switched around a failing path, or span therein, prior to an actual failure event.

US Patent:

7885492, Feb 8, 2011

Filed:

Dec 11, 2002

Appl. No.:

10/317935

Inventors:

David F. Welch - Menlo Park CA, US
Vincent G. Dominic - Fremont CA, US
Mark J. Missey - San Jose CA, US
Radhakrishnan L. Nagarajan - Cupertino CA, US
Atul Mathur - Santa Clara CA, US
Frank H. Peters - San Jose CA, US
Robert B. Taylor - Windsor Mill MD, US
Matthew L. Mitchell - Sunnyvale CA, US
Alan C. Nilsson - Mountain View CA, US
Stephen G. Grubb - Ellicott City MD, US
Richard P. Schneider - Sunnyvale CA, US
Charles H. Joyner - Sunnyvale CA, US
Marco E. Sosa - San Jose CA, US

Assignee:

Infinera Corporation - Sunnyvale CA

International Classification:

G02B 6/12

US Classification:

385 14

Abstract:

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

US Patent:

8300994, Oct 30, 2012

Filed:

Feb 7, 2011

Appl. No.:

13/022614

Inventors:

David F. Welch - Menlo Park CA, US
Vincent G. Dominic - Fremont CA, US
Mark J. Missey - San Jose CA, US
Radhakrishnan L. Nagarajan - Cupertino CA, US
Atul Mathur - San Jose CA, US
Frank H. Peters - San Jose CA, US
Robert B. Taylor - Windsor Mill MD, US
Matthew L. Mitchell - Bethesda MD, US
Alan C. Nilsson - Mountain View CA, US
Stephen G. Grubb - Ellicott City MD, US
Richard P. Schneider - Mountain View CA, US
Charles H. Joyner - Sunnyvale CA, US
Marco E. Sosa - San Jose CA, US

Assignee:

Infinera Corporation - Sunnyvale CA

International Classification:

G02B 6/12

US Classification:

385 14

Abstract:

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

US Patent:

8442040, May 14, 2013

Filed:

Jun 30, 2006

Appl. No.:

11/479778

Inventors:

Drew D. Perkins - Saratoga CA, US
Marco E. Sosa - San Jose CA, US
Mark Yin - Cupertino CA, US
Edward E. Sprague - Woodside CA, US

Assignee:

Infinera Corporation - Sunnyvale CA

International Classification:

H04L 12/50

US Classification:

370359, 370360, 3703952, 3703956, 370401, 370410, 370419, 370422

Abstract:

The present invention provides a system, apparatus and method for modularly adapting a network node architecture to function in one of a plurality of potential node types. The architecture includes a configurable switching element, integrated optics, and a plurality of modules that allow a “type” of node to be adapted and configured within the base architecture. The module interfaces may be optical or electrical and be used to construct various different types of nodes including regenerators, add/drop nodes, terminal nodes, and multi-way nodes using the same base architecture.

US Patent:

8553725, Oct 8, 2013

Filed:

Sep 30, 2011

Appl. No.:

13/249642

Inventors:

Iftekhar Hussain - Santa Clara CA, US
Abinder Dhillon - Allen TX, US
Zhong Pan - San Jose CA, US
Marco E. Sosa - San Jose CA, US

Assignee:

Infinera Corporation - Sunnyvale CA

International Classification:

H04J 4/00

US Classification:

370478, 398 43, 398 55, 398 68, 398 69

Abstract:

A node is configured to receive an instruction to establish a channel having a bandwidth that corresponds to an operating spectrum an optical fiber; obtain information that identifies a channel spacing and a pointer that identifies where, within the spectrum, to establish bandwidth allocations; identify a group of bandwidth segments based on the spectrum and the channel spacing; and generate bit words that correspond to the bandwidth allocations, where the bit words includes bits that, when set to a value, cause sets of segments to be reserved within the spectrum, and where the sets of segments identify where the bandwidth allocations begin and end, within the spectrum, relative to the pointer.

US Patent:

20050025409, Feb 3, 2005

Filed:

May 25, 2004

Appl. No.:

10/852988

Inventors:

David Welch - Menlo Park CA, US
Vincent Dominic - Fremont CA, US
Fred Kish - Palo Alto CA, US
Mark Missey - San Jose CA, US
Radhakrishnan Nagarajan - Cupertino CA, US
Atul Mathur - San Jose CA, US
Frank Peters - San Jose CA, US
Robert Taylor - Windsor Mill MD, US
Matthew Mitchell - Bethesda MD, US
Alan Nilsson - Mountain View CA, US
Stephen Grubb - Ellicott City MD, US
Richard Schneider - Mountain View CA, US
Charles Joyner - Sunnyvale CA, US
Jonas Webjorn - Redwood City CA, US
Robert Grencavich - Kempton PA, US
Vinh Nguyen - Bethlehem PA, US
Donald Pavinski - Alburtis PA, US
Marco Sosa - San Jose CA, US

Assignee:

Infinera Corporation - Sunnyvale CA

International Classification:

G02B006/12

US Classification:

385014000

Abstract:

A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.

US Patent:

20080031626, Feb 7, 2008

Filed:

Oct 9, 2007

Appl. No.:

11/869420

Inventors:

David Welch - Menlo Park CA, US
Vincent Dominic - Dayton OH, US
Fred Kish - Palo Alto CA, US
Mark Missey - San Jose CA, US
Radhakrishnan Nagarajan - Cupertino CA, US
Atul Mathur - San Jose CA, US
Frank Peters - San Jose CA, US
Robert Taylor - Charleston SC, US
Matthew Mitchell - Sunnyvale CA, US
Alan Nilsson - Mountain View CA, US
Stephen Grubb - Ellicott City MD, US
Richard Schneider - Mountain View CA, US
Charles Joyner - Sunnyvale CA, US
Jonas Webjorn - Redwood City CA, US
Robert Grencavich - Kempton PA, US
Vinh Nguyen - Bethlehem PA, US
Donald Pavinski - Alburtis PA, US
Marco Sosa - San Jose CA, US

Assignee:

INFINERA CORPORATION - Sunnyvale CA

International Classification:

H04J 14/02

US Classification:

398079000

Abstract:

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.