James J. Briguglio - Balboa CA Leo Roos - Laguna Beach CA Clancy P. Crooks - Cypress CA Samuel W. Shoemaker - San Bernardino CA
Assignee:
Morton International, Inc. - Chicago IL
International Classification:
G03C 1112
US Classification:
430258
Abstract:
A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board. With heat, vacuum and mechanical pressure, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, partially conforming the photoimageable composition layer to the contours thereof. Within about 60 seconds and with the photoimageable composition layer still heated, the cover sheet is peeled away, leaving the top coat as a protective covering over the photoimageable composition layer. Removal of the cover sheet allows the photoimageable composition layer to fully conform to the contours of the printed circuit board. Immediately thereafter, the circuit board is cooled to about ambient temperature or below.
Photoinitiator Composition Containing Bis Ketocoumarin Dialkylamino Benzoate, Camphorquinone And/Or A Triphenylimidazolyl Dimer
Robert Barr - Huntington Beach CA Leo Roos - Laguna Beach CA Lawrence Crane - Tustin CA
Assignee:
Morton Thiokol, Inc. - Chicago IL
International Classification:
G03C 168 G03C 170
US Classification:
430281
Abstract:
Photoinitiator compositions are disclosed which contain 3,3'-carbonyl bis(7-diethylaminocoumarin); an alkyl ester of a p-dialkylamino benzoic acid; and either camphorquinone or a 2,4,5-triphenylimidazolyl dimer. Photoinitiators are also provided which contain 3,3'-carbonyl bis(7-diethylaminocoumarin); an alkyl ester of a p-dialkylamino benzoic acid; camphorquinone and a 2,4,5-triphenylimidazolyl dimer. These latter photoinitiators are particularly useful in photopolymerizable compositions which are polymerized by exposure to visible laser light.
Photoimageable Composition With Reduced Cold Flow Due To Salt-Bridging By Metal Ions And Dry Film Formed Therefrom
Melvin A. Lipson - Newport Beach CA Thomas P. Carter - Laguna Beach CA James G. Shelnut - Lake Forest CA Leo Roos - Laguna Beach CA
Assignee:
Morton Thiokol, Inc. - Chicago IL
International Classification:
G03C 190 G03C 168
US Classification:
430260
Abstract:
A photoimageable composition of the negative acting type which includes a binder polymer which contains carboxyl groups is provided with a metal chelate in which the coordination number of the metal is 2 or higher. When the photoimageable composition is coated as a layer on a dry film, the metal chelate reacts with the carboxyl groups of the polymer, releasing a metal ion which bridges carboxyl groups of two or more polymer molecules. This bridging reduces cold flow of the photoimageable composition layer of the dry film.
Method Of Forming A Conformable Mask On A Printed Circuit Board
Leo Roos - Laguna Beach CA Fredrick J. Axon - Worsley, GB2 James J. Briguglio - Newport Beach CA
Assignee:
Morton Thiokol, Inc. - Chicago IL
International Classification:
G03C 1112
US Classification:
439258
Abstract:
A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board with a minor portion of the area of the photoimageable composition layer tacked to the printed circuit board. The cover sheet is peeled away. With heat and vacuum, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, conforming the photoimageable composition layer to the contours thereof and leaving the top coat as a protective covering over the photoimageable composition layer. The photoimageable composition layer is exposed to patterned actinic radiation, developed and cured to form a hard, permanent solder mask.
Dry Film Photoresist For Forming A Conformable Mask And Method Of Application To A Printed Circuit Board Or The Like
Leo Roos - Laguna Beach CA Fredrick J. Axon - Manchester, GB2 James J. Briguglio - Newport Beach CA
Assignee:
Morton International, Inc. - Chicago IL
International Classification:
G03C 178
US Classification:
430270
Abstract:
A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board with a minor portion of the area of the photoimageable composition layer tacked to the printed circuit board. The cover sheet is peeled away. With heat and vacuum, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, conforming the photoimageable composition layer to the contours thereof and leaving the top coat as a protective covering over the photoimageable composition layer. The photoimageable composition layer is exposed to patterned actinic radiation, developed and cured to form a hard, permanent solder mask.
Dry Film Photoresist For Forming A Conformable Mask And Method Of Application To A Printed Circuit Board Or The Like
Frederick J. Axon - Manchester, GB2 James J. Briguglio - Newport Beach CA Amedeo Candore - Bodio Lomnago, IT Lawson Lightfoot - Chesire, GB2 Clancy P. Crooks - Cypress CA Leo Roos - Laguna Beach CA
Assignee:
Morton International, Inc. - Chicago IL
International Classification:
G03C 1112
US Classification:
430258
Abstract:
A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board with a minor portion of the area of the photoimageable composition layer tacked to the printed circuit board. The cover sheet is peeled away. With heat and vacuum, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, conforming the photoimageable composition layer to the contours thereof and leaving the top coat as a protective covering over the photoimageable composition layer. The photoimageable composition layer is exposed to patterned actinic radiation, developed and cured to form a hard, permanent solder mask.