Lawrence A Kay

US Patent:

7861915, Jan 4, 2011

Filed:

Apr 18, 2005

Appl. No.:

11/108400

Inventors:

Lawrence C. Kay - Los Angeles CA, US
Erik J. Severin - Pasadena CA, US
Luis A. Aguirre - Norwalk CA, US

Assignee:

MS2 Technologies, LLC - Los Angeles CA

International Classification:

B23K 31/02

US Classification:

228260, 228 37, 228256, 228 34

Abstract:

A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.

US Patent:

8584925, Nov 19, 2013

Filed:

Aug 15, 2011

Appl. No.:

13/210311

Inventors:

Lawrence C. Kay - Sherman Oaks CA, US
Erik J. Severin - Saint Paul MN, US
Luis A. Aguirre - San Antonio TX, US

Assignee:

MS2 Technologies, LLC - Los Angeles CA

International Classification:

B23K 31/02

US Classification:

228260, 228 37

Abstract:

A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.

US Patent:

20060011267, Jan 19, 2006

Filed:

May 27, 2005

Appl. No.:

11/140432

Inventors:

Lawrence Kay - Los Angeles CA, US
Terry Munson - Kokomo IN, US
Erik Severin - Pasadena CA, US

International Classification:

B23K 35/34

US Classification:

148023000

Abstract:

A solder paste comprises a lead-free solder powder, a flux and an active additive in the flux. The active additive comprises a material that scavenges metal oxide from molten solder, is a stable liquid at reflow soldering temperature, and has the ability to assimilate oxide of at least one metal in the solder. A preferred active additive is dimer acid present in the range of from 0.5 to 2.5% percent by weight of the paste. Sound joint are obtained when the paste is used in a reflow soldering process wherein the peak reflow temperature is preferably less than 245 C.

US Patent:

20060186175, Aug 24, 2006

Filed:

Feb 15, 2006

Appl. No.:

11/355724

Inventors:

Lawrence Kay - Los Angeles CA, US

International Classification:

B23K 1/08

US Classification:

228036000

Abstract:

A container for soldering adjuvant is made of a metal having a composition similar to the composition of a solder bath. Preferably, the container holds solder paste and the container is made of metal having a composition similar to the composition of the metal part of the paste in the container. Exemplary alloys from which the container is made include 2.5 to 5% silver, up to 2% copper and a balance of tin; and a lead-tin eutectic composition.

US Patent:

20110062215, Mar 17, 2011

Filed:

Nov 23, 2010

Appl. No.:

12/952962

Inventors:

Lawrence C. Kay - Sherman Oaks CA, US
Erik J. Severin - Saint Paul MN, US
Luis A. Aguirre - San Antonio TX, US

International Classification:

C22B 9/02
B23K 3/06

US Classification:

228 52, 75407

Abstract:

A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.