Kurt B Friel

US Patent:

20040251230, Dec 16, 2004

Filed:

Jun 16, 2003

Appl. No.:

10/462447

Inventors:

Leonard Wardzala - Burlington WI, US
Gregory Ballard - Belvidere IL, US
Kurt Friel - Sycamore IL, US

International Classification:

H01B013/00

US Classification:

216/013000

Abstract:

A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.

US Patent:

20070237480, Oct 11, 2007

Filed:

Feb 21, 2007

Appl. No.:

11/709331

Inventors:

Leonard Wardzala - Burlington WI, US
Gregory Ballard - Belvidere IL, US
Kurt Friel - Sycamore IL, US

International Classification:

G02B 6/12
C23C 26/00

US Classification:

385129000, 427096100

Abstract:

A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.

US Patent:

20110039372, Feb 17, 2011

Filed:

Aug 13, 2010

Appl. No.:

12/856101

Inventors:

Peter V. Loeppert - Hoffman Estates IL, US
Denise P. Czech - Schaumburg IL, US
Lawrence A. Grunert - Lombard IL, US
Kurt B. Friel - Sycamore IL, US
Qing Wang - Bloomingdale IL, US

International Classification:

H01L 21/78

US Classification:

438114, 257E21599

Abstract:

A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.

US Patent:

20140037124, Feb 6, 2014

Filed:

Jul 24, 2013

Appl. No.:

13/949337

Inventors:

Kurt B. Friel - Sycamore IL, US

Assignee:

Knowles Electronics, LLC - Itasca IL

International Classification:

H04R 1/02
H05K 1/18

US Classification:

381386, 361748

Abstract:

An acoustic device includes a substrate, a substrate cover, and a plurality of electrical and acoustic components. The substrate cover is disposed on the substrate and the plurality of electrical and acoustic components are disposed on the substrate and under the substrate cover. The substrate cover is constructed of a base metal and the substrate cover comprises a partially plating. The partial plating is arranged so as to prevent solder creep along a surface of the substrate cover.

US Patent:

20170026729, Jan 26, 2017

Filed:

Jul 21, 2016

Appl. No.:

15/216627

Inventors:

- Itasca IL, US
Norman Dennis Talag - Woodridge IL, US
Kurt B. Friel - Sycamore IL, US

Assignee:

Knowles Electronics, LLC - Itasca IL

International Classification:

H04R 1/04
G01L 9/00
H04R 29/00

Abstract:

A microphone includes a base, a MEMS device, and an integrated circuit. The MEMS device includes a diaphragm and a back plate. The MEMS device is connected to the integrated circuit. The microphone also includes a pressure sensor. A lid enclosed the MEMS device and the integrated circuit.

US Patent:

20170026730, Jan 26, 2017

Filed:

Jul 21, 2016

Appl. No.:

15/216628

Inventors:

- Itasca IL, US
Joshua Watson - Aurora IL, US
Lance Barron - Plano TX, US
Kurt B. Friel - Sycamore IL, US
Norman Dennis Talag - Woodridge IL, US

Assignee:

Knowles Electronics, LLC - Itasca IL

International Classification:

H04R 1/04
G01K 7/16
H04R 19/00
G01K 1/14

Abstract:

A microphone includes a base, a MEMS device, and an integrated circuit. The MEMS device includes a diaphragm and a back plate. The MEMS device is connected to the integrated circuit. The microphone also includes a temperature sensor. A lid enclosed the MEMS device and the integrated circuit.

US Patent:

20170026760, Jan 26, 2017

Filed:

Jul 21, 2016

Appl. No.:

15/216630

Inventors:

- Itasca IL, US
Joshua Watson - Aurora IL, US
Kurt B. Friel - Sycamore IL, US
Norman Dennis Talag - Woodridge IL, US
Sung Bok Lee - Chicago IL, US

Assignee:

Knowles Electronics, LLC - Itasca IL

International Classification:

H04R 23/00
G01N 27/22

Abstract:

Various embodiments relating to microphone with integrated sensor are disclosed herein. In one implementation, a sensor is disposed in, on, integrated with, and/or at the lid of a micro electro mechanical system (MEMS) microphone. In another implementation, a sensor is disposed at or integrated with an insert, over which a micro electro mechanical system (MEMS) device is disposed in a MEMS microphone. In disposing the sensor at the lid or insert, significant space savings are achieved. Consequently, a small-sized microphone is provided and achieved allowing the microphone deployed in applications where miniaturization is required or advantageous.

US Patent:

20150166335, Jun 18, 2015

Filed:

Feb 26, 2015

Appl. No.:

14/632428

Inventors:

- Itasca IL, US
Denise P. Czech - Schaumburg IL, US
Lawrence A. Grunert - Lombard IL, US
Kurt B. Friel - Sycamore IL, US
Qing Wang - Hanover Park IL, US

International Classification:

B81C 1/00

Abstract:

A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.