Kriss A Bennett

US Patent:

6919125, Jul 19, 2005

Filed:

Aug 1, 2003

Appl. No.:

10/632152

Inventors:

Kriss Allen Bennett - Torrance CA, US
Roy Tom Coyle - Redondo Beach CA, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

B32B003/00

US Classification:

428210, 428209, 428212, 4284722, 174258

Abstract:

Ceramic substrates () for microelectronic modules are formed in multiple layers (& ) fused into a unitary one-piece assembly. The layers contain the same ceramic material but in different purity so that one outer layer () is optimal in composition for bonding to a thick film conductor () and the other outer layer () is optimal in composition for bonding to a thin film conductor (). In a dual composition substrate embodiment one layer is formed of a 96% alumina composition and the second layer is formed of a 99. 6% alumina composition.

US Patent:

20020181523, Dec 5, 2002

Filed:

May 29, 2001

Appl. No.:

09/867042

Inventors:

George Pinneo - Manhattan Beach CA, US
Marijan Grgas - Rancho Palos Verdes CA, US
Kriss Bennett - Long Beach CA, US

International Classification:

H01S005/00

US Classification:

372/043000

Abstract:

A semiconductor laser diode array including a plurality of laser diode bars, each carried by a submount and forming a subassembly. Each subassembly is separated by a flexible or compliant electrically conductive spacer. All connections within the array are by way of a non-fluxed solder, that may be hard and/or soft, reflowed in a non-oxidizing atmosphere in a simple mechanical stack fixture to create nearly void-free solder joints with relatively high thermal integrity and electrical conductivity. Flexible electrically conductive spacers are disposed between the subassemblies to eliminate tensile stress on the laser diode bars while providing electrical conductivity between subassemblies. The subassemblies are carried by a thermally conductive dielectric substrate, allowing waste heat generated from the bars to be conducted to a cooling device. The invention eliminates known failure modes in interconnections, minimizing tensile strength on the diode arrays, and increasing the useful life of the array.

US Patent:

20050205197, Sep 22, 2005

Filed:

May 11, 2005

Appl. No.:

11/127373

Inventors:

Kriss Bennett - Torrance CA, US
Roy Coyle - Redondo Beach CA, US

International Classification:

C03B029/00

US Classification:

156089110, 264619000, 264615000, 264618000, 264655000

Abstract:

Ceramic substrates () for microelectronic modules are formed in multiple layers () fused into a unitary one-piece assembly. The layers contain the same ceramic material but in different purity so that one outer layer () is optimal in composition for bonding to a thick film conductor () and the other outer layer () is optimal in composition for bonding to a thin film conductor (). In a dual composition substrate embodiment one layer is formed of a 96% alumina composition and the second layer is formed of a 99.6% alumina composition.