Keith J Cendak

US Patent:

7186613, Mar 6, 2007

Filed:

Oct 13, 2004

Appl. No.:

10/964499

Inventors:

John Francis Kirner - Orefield PA, US
James Edward MacDougall - New Tripoli PA, US
Brian Keith Peterson - Fogelsville PA, US
Scott Jeffrey Weigel - Allentown PA, US
Thomas Alan Deis - Vista CA, US
Martin Devenney - Mountain View CA, US
C. Eric Ramberg - San Jose CA, US
Konstantinos Chondroudis - Sunnyvale CA, US
Keith Cendak - Millbrae CA, US

Assignee:

Air Products And Chemicals, Inc. - Allentown PA

International Classification:

H01L 21/8242
H01L 29/94

US Classification:

438240, 257310

Abstract:

Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (κ) a dielectric constant of about 3. 7 or less; a normalized wall elastic modulus (E′), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1. 95 and a normalized wall elastic modulus (E′), derived in part from the dielectric constant of the material, of greater than about 26 GPa.

US Patent:

7294585, Nov 13, 2007

Filed:

Jul 11, 2006

Appl. No.:

11/484049

Inventors:

Brian Keith Peterson - Fogelsville PA, US
John Francis Kirner - Orefield PA, US
Scott Jeffrey Weigel - Allentown PA, US
James Edward MacDougall - New Tripoli PA, US
Lisa Deis, legal representative - Pittsburgh PA, US
Thomas Albert Braymer - Allentown PA, US
Keith Douglas Campbell - Slatington PA, US
Martin Devenney - Mountain View CA, US
C. Eric Ramberg - San Jose CA, US
Konstantinos Chondroudis - Sunnyvale CA, US
Keith Cendak - Millbrae CA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

H01L 21/31
H01L 21/469

US Classification:

438780, 438781, 438787, 257E21261, 257E21273

Abstract:

Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.

US Patent:

7307343, Dec 11, 2007

Filed:

May 30, 2002

Appl. No.:

10/158511

Inventors:

John Francis Kirner - Orefield PA, US
James Edward MacDougall - New Tripoli PA, US
Brian Keith Peterson - Fogelsville PA, US
Scott Jeffrey Weigel - Allentown PA, US
Thomas Alan Deis - Vista CA, US
Martin Devenney - Mountain View CA, US
C. Eric Ramberg - San Jose CA, US
Konstantinos Chondroudis - Sunnyvale CA, US
Keith Cendak - Millbrae CA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

H01L 23/48

US Classification:

257758, 257759, 257642, 257E23145, 257E21547, 4283122, 4283126

Abstract:

Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (κ) a dielectric constant of about 3. 7 or less; a normalized wall elastic modulus (E′), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1. 95 and a normalized wall elastic modulus (E′), derived in part from the dielectric constant of the material, of greater than about 26 GPa.

US Patent:

7422994, Sep 9, 2008

Filed:

Dec 21, 2005

Appl. No.:

11/314262

Inventors:

Konstantinos Chondroudis - Thessaloniki, GR
Alexander Gorer - San Jose CA, US
Peter Strasser - Houston TX, US
Martin Devenney - Mountain View CA, US
Qun Fan - Fremont CA, US
Daniel M. Giaquinta - Mountain View CA, US
Keith James Cendak - San Mateo CA, US
Hiroyuki Oyanagi - Utsunomiya, JP
Kenta Urata - Utsunomiya, JP

Assignee:

Symyx Technologies, Inc. - Santa Clara CA
Honda Giken Kogyo Kabushiki Kaisha - Minato-Ku, Tokyo

International Classification:

B01J 21/18
B01J 23/00
B01J 23/40
B01J 23/74
C22C 27/04
C22C 5/04
C22C 9/00
C22C 30/02
C22C 27/06
C22C 5/00
C22C 30/00

US Classification:

502185, 502182, 502184, 502313, 502318, 420431, 420466, 420469, 420497, 420587, 148423, 148430, 148432, 148442

Abstract:

A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper and tungsten, or an oxide, carbide and/or salt of one or more of platinum, copper and tungsten, wherein the sum of the concentrations of platinum, copper and tungsten, or an oxide, carbide and/or salt thereof, is greater than 90 atomic percent.

US Patent:

7482676, Jan 27, 2009

Filed:

Jul 11, 2006

Appl. No.:

11/484075

Inventors:

Brian Keith Peterson - Fogelsville PA, US
John Francis Kirner - Orefield PA, US
Scott Jeffrey Weigel - Allentown PA, US
James Edward MacDougall - New Tripoli PA, US
Lisa Deis - Pittsburgh PA, US
Thomas Albert Braymer - Allentown PA, US
Keith Douglas Campbell - Slatington PA, US
Martin Devenney - Mountain View CA, US
C. Eric Ramberg - San Jose CA, US
Konstantinos Chondroudis - Sunnyvale CA, US
Keith Cendak - Millbrae CA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

H01L 21/31
H01L 21/469

US Classification:

257632, 257E21261, 257E21273, 438780, 438781

Abstract:

Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.

US Patent:

7608560, Oct 27, 2009

Filed:

Jun 7, 2004

Appl. No.:

10/559720

Inventors:

Qun Fan - Fremont CA, US
Peter Strasser - Houston TX, US
Alexander Gorer - San Jose CA, US
Martin Devenney - Mountain View CA, US
Ting He - Dublin OH, US
Hiroyuki Oyanagi - Saitama, JP
Daniel M. Giaquinta - Saratoga CA, US
Kenta Urata - Utsunomiya, JP
Hiroichi Fukuda - Utsunomiya, JP
Konstantinos Chondroudis - Thessaloniki, GR
Keith James Cendak - San Mateo CA, US

Assignee:

Symyx Technologies, Inc. - Santa Clara CA
Honda Giken Kogyo Kabushiki Kaisha - Minato-Ku, Tokyo

International Classification:

B01J 21/18
B01J 23/00
B01J 23/40
B01J 23/42
C22C 14/00
C22C 27/04
C22C 27/00
C22C 32/00
C22C 5/04
H01M 4/00

US Classification:

502313, 502308, 502309, 502326, 502334, 502180, 502182, 502185, 429 40, 429 41, 429 42, 429 43, 429 44, 420417, 420430, 420432, 420466

Abstract:

A fuel cell catalyst comprising platinum, titanium and tungsten. In one or more embodiments, the concentration of platinum is less than 60 atomic percent, and/or the concentration of titanium is at least 20 atomic percent, and/or the concentration of tungsten is at least 25 atomic percent.

US Patent:

7662740, Feb 16, 2010

Filed:

Jun 3, 2004

Appl. No.:

10/559637

Inventors:

Konstantinos Chondroudis - Thessaloniki, GR
Alexander Gorer - San Jose CA, US
Martin Devenney - Mountain View CA, US
Ting He - Dublin OH, US
Hiroyuki Oyanagi - Saitama, JP
Daniel M. Giaquinta - Saratoga CA, US
Kenta Urata - Utsunomiya, JP
Hiroichi Fukuda - Utsunomiya, JP
Qun Fan - Pleasanton CA, US
Peter Strasser - Houston TX, US
Keith James Cendak - San Mateo CA, US

Assignee:

Symyx Technologies, Inc. - Santa Clara CA
Honda Giken Kogyo Kabushiki Kaisha - Minato-Ku, Tokyo

International Classification:

B01J 21/18
B01J 23/00
B01J 23/40
B01J 23/74
B01J 25/00
C22C 19/05
C22C 19/03
C22C 5/04
C22C 9/06
C22C 9/00
C22C 30/02
C22C 30/00
C22C 27/06

US Classification:

502180, 502182, 502185, 502301, 420442, 420444, 420456, 420457, 420468, 420485, 420497, 420582, 420583, 4205844, 420587, 420588, 420428, 420466, 420441, 420443, 420445, 420446, 420447, 420448, 420449, 420450, 420451, 420452, 420453, 420454, 420455, 420458, 420459, 420460, 420469, 420580

Abstract:

A fuel cell catalyst comprising platinum, chromium, and copper, nickel or a combination thereof. In one or more embodiments, the concentration of platinum is less than 50 atomic percent, and/or the concentration of chromium is less than 30 atomic percent, and/or the concentration of copper, nickel, or a combination thereof is at least 35 atomic percent.

US Patent:

7700521, Apr 20, 2010

Filed:

Aug 18, 2004

Appl. No.:

10/568516

Inventors:

Daniel M. Giaquinta - Mountain View CA, US
Peter Strasser - Houston TX, US
Alexander Gorer - San Jose CA, US
Martin Devenney - Mountain View CA, US
Hiroyuki Oyanagi - Utsunomiya, JP
Kenta Urata - Wako, JP
Hiroichi Fukuda - Saitama, JP
Keith James Cendak - San Mateo CA, US
Konstantinos Chondroudis - Thessaloniki, GR

Assignee:

Symyx Solutions, Inc. - Sunnyvale CA
Honda Giken Kogyo Kabushiki Kaisha - Tokyo

International Classification:

B01J 23/70
B01J 23/00
B01J 23/40
B01J 23/58
B01J 23/42

US Classification:

502345, 502184, 502185, 502325, 502330, 502334

Abstract:

The present invention is directed to a composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum and copper, wherein the concentration of platinum is greater than 50 atomic percent and less than about 80 atomic percent, and further wherein the composition has a particle size which is less than 35 angstroms. The present invention is further directed to various methods for preparing such a composition.