Karen J Bruzda

US Patent:

20090117345, May 7, 2009

Filed:

Sep 4, 2008

Appl. No.:

12/204228

Inventors:

Jason L. Strader - Cleveland OH, US
Mark Wisniewski - Mentor OH, US
Karen Bruzda - Cleveland OH, US
Michael Craig - Painesville OH, US

Assignee:

Laird Technologies, Inc. - Chesterfield MO

International Classification:

C09K 5/00
B29C 65/02
B32B 3/10
B32B 37/00

US Classification:

4281951, 428336, 427256, 4272481, 156 60, 156289, 156295

Abstract:

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

US Patent:

20100256280, Oct 7, 2010

Filed:

Apr 7, 2009

Appl. No.:

12/419965

Inventors:

Karen J. Bruzda - Cleveland OH, US

Assignee:

Laird Technologies, Inc. - Chesterfield MO

International Classification:

C08K 3/38
C08L 75/04

US Classification:

524404, 524589

Abstract:

A method of forming a resin and filler composite system generally includes softening a polymer formed by a moisture sensitive chemical reaction of one or more monomers, and adding at least one or more fillers to the softened polymer to form a resin and filler composite system. Formation of foam is substantially inhibited when adding at least one or more fillers to the softened polymer.

US Patent:

20110204280, Aug 25, 2011

Filed:

Feb 23, 2010

Appl. No.:

12/710538

Inventors:

Karen J. Bruzda - Cleveland OH, US

Assignee:

Laird Technologies, Inc. - Chesterfield MO

International Classification:

C09K 5/00

US Classification:

252 74, 252 71, 252 73

Abstract:

Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.

US Patent:

20120080639, Apr 5, 2012

Filed:

Oct 4, 2010

Appl. No.:

12/897309

Inventors:

Karen Bruzda - Cleveland OH, US
Richard F. Hill - Parkman OH, US

Assignee:

LAIRD TECHNOLOGIES, INC. - Chesterfield MO

International Classification:

C09K 5/00
G21F 1/10

US Classification:

252 70, 252478

Abstract:

Various potato graphite filler, thermal interface materials, EMI shielding materials and methods of making thermal interface and EMI shielding materials are disclosed. An example thermal interface material includes a matrix material and a graphite filler suspended in the matrix material. The graphite filler includes potato graphite particles.

US Patent:

20120292005, Nov 22, 2012

Filed:

May 19, 2011

Appl. No.:

13/111735

Inventors:

Karen Bruzda - Cleveland OH, US
Richard F. Hill - Parkman OH, US
Brian Jones - Warren OH, US
Michael D. Craig - Painesville OH, US

Assignee:

LAIRD TECHNOLOGIES, INC. - Chesterfield MO

International Classification:

F28F 7/00

US Classification:

165185

Abstract:

A thermal interface material is provided for use to fill a gap between surfaces in a thermal transfer system to transfer heat between the surfaces. The thermal interface material includes a base material and thermally conductive particles dispersed within the base material. The thermal interface material is conditioned under reduced pressure (e.g., prior to being placed in the gap between the surfaces, while being placed in the gap, after being placed in the gap, etc.) and, within about forty-eight hours or less of conditioning, the conditioned thermal interface material is either positioned in a container that inhibits ambient gas from contacting it (either alone or applied to the surfaces), or used to transfer heat between the surfaces. As such, the thermal interface material is substantially free of cracks following exposure to thermal cycling comprising a temperature change of at least about 100 degrees Celsius for at least about 10 cycles.

US Patent:

20130265721, Oct 10, 2013

Filed:

May 20, 2013

Appl. No.:

13/897625

Inventors:

Mark Wisniewski - Mentor OH, US
Karen Bruzda - Cleveland OH, US
Michael D. Craig - Painesville OH, US

International Classification:

H05K 7/20

US Classification:

361705, 428336, 4281951, 156230, 264299, 156 60

Abstract:

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

US Patent:

20150334871, Nov 19, 2015

Filed:

Jun 24, 2014

Appl. No.:

14/313510

Inventors:

- Earth City MO, US
Mark Wisniewski - Mentor OH, US
Karen Bruzda - Cleveland OH, US

International Classification:

H05K 7/20
B32B 27/40
B32B 27/06
B32B 37/04
B32B 9/04

Abstract:

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In an exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side. A dry material is along at least a portion of the first side of the thermal interface material. The dry material has a thickness less than 0.005 millimeters. At least one edge of the thermal interface material is sealed at least partially by the dry material.

US Patent:

20140262191, Sep 18, 2014

Filed:

Mar 15, 2013

Appl. No.:

13/840119

Inventors:

- Chesterfield MO, US
Karen J. Bruzda - Cleveland OH, US
Richard F. Hill - Parkman OH, US

Assignee:

LAIRD TECHNOLOGIES, INC. - Chesterfield MO

International Classification:

F28F 3/00

US Classification:

165185, 156 60, 4274211, 4274301, 42742801

Abstract:

A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.