Joseph M Zachman

US Patent:

20100233503, Sep 16, 2010

Filed:

Mar 10, 2010

Appl. No.:

12/721027

Inventors:

Joseph M. Zachman - Lafayette IN, US
Brett Allan Brooks - West Lafayette IN, US
Patrick M. Griffin - Lafayette IN, US
Brian L. Yeagy - Lafayette IN, US
David Pickup - Lafayette IN, US
Dwaine D. Speer - West Lafayette IN, US
David P. Kunkel - Lebanon IN, US

International Classification:

B32B 3/12
B32B 3/28
B32B 15/01

US Classification:

428593, 428178

Abstract:

A panel for a storage container, such as a trailer, for example, includes a first, generally planar layer and a second layer coupled to the first layer. The second layer is configured to define a plurality of channels therein.

US Patent:

50809296, Jan 14, 1992

Filed:

Apr 2, 1990

Appl. No.:

7/503407

Inventors:

Joseph M. Zachman - Greentown IN
Clyde E. Ragan - Greentown IN
Steven L. Alexander - Westfield IN
Bruce A. Myers - Kokomo IN
Charles T. Eytcheson - Kokomo IN

Assignee:

Delco Electronics Corporation - Kokomo IN

International Classification:

C23C 2600

US Classification:

427 97

Abstract:

A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.

US Patent:

53225651, Jun 21, 1994

Filed:

Dec 19, 1991

Appl. No.:

7/810246

Inventors:

Joseph M. Zachman - Greentown IN
Clyde E. Ragan - Greentown IN
Steven L. Alexander - Westfield IN
Bruce A. Myers - Kokomo IN
Charles T. Eytcheson - Kokomo IN

Assignee:

Delco Electronics Corporation - Kokomo IN

International Classification:

B05C 1300

US Classification:

118500

Abstract:

A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.

US Patent:

53086457, May 3, 1994

Filed:

Aug 7, 1992

Appl. No.:

7/925839

Inventors:

Joseph M. Zachman - Greentown IN
Donald E. Eagle - Greentown IN
Sherri L. Bernhard - Noblesville IN
Michael G. Coady - Kokomo IN
Jeffery P. Somers - Kokomo IN

Assignee:

Delco Electronics Corporation - Kokomo IN

International Classification:

B05D 512

US Classification:

427 97

Abstract:

Disclosed is an apparatus and method of through hole substrate printing wherein the apparatus includes a nest plate having a plurality of vacuum source holes formed therein of a size substantially greater than the through holes in the substrate, and a plurality of removable pointed pins supporting the substrate in a substantially flat and horizontal position during the printing operation. The removably pointed pins allow for the flexibility of printing a variety of conductive patterns for different substrates and without the risk of breaking the substrate or smearing the conductive pattern on the bottom surface of the substrate or the subsequent substrate to be printed.