Dr. Horvath graduated from the Temple University School of Medicine in 1988. He works in Columbia, SC and specializes in Infectious Disease. Dr. Horvath is affiliated with Intermedical Hospital South Carolina, Palmetto Health Baptist Parkridge, Palmetto Health Richland Hospital and Providence Health.
Joseph L. Horvath - Poughkeepsie NY Robert G. Biskeborn - Pawling NY Joseph M. Harvilchuck - Billings NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
F28F 700
US Classification:
165185
Abstract:
The present invention dissipates the heat generated by high powered VLSI chips to a heat sink in a very efficient manner, providing a thermal resistance heretofore not possible in heat conduction module cold plate type systems. A finned internal thermal device having a flat bottom contacts the chips, while corresponding fins in a finned cooling hat mounted to a cold plate form gaps into which the fins of the finned internal thermal devices are slidably mounted. A preferred double cantilever spring between the finned internal thermal devices and fins of the finned cooling hat and a compliant thermally conductive interface such as synthetic oil between the chips and flat base of the finned internal devices provide efficient, non-rigid interfaces throughout the system, while assuring good thermal contact between the system components. The present high conduction cooling module allows for the simple incorporation of side biasing means and a grooved chip interface on the finned internal thermal devices to provide enhanced thermal performance if required.
Unitary Slotted Heat Sink For Semiconductor Packages
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2334 H01L 2346 H01L 2312
US Classification:
357 81
Abstract:
A unitary heat sink for a semiconductor package having a plurality of cooling fin elements, each element having upwardly extending openings that divide the base into a plurality of leg portions, the heat sink having a plurality of flat base portions individually bonded to a surface of the package, each of the leg portions of an individual fin element being integral with different but adjacent flat base portions, in operation the heat sink preventing a build-up of stresses at the bonded interface of the base portions and package due to differential coefficient of expansions of the heat sink and package.
Joseph L. Horvath - Poughkeepsie NY Mark H. McLeod - Poughkeepsie NY Carl Yakubowski - Hyde Park NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
US Classification:
361386
Abstract:
In an electronic package, improved disk shaped thermal bridge elements provide multiple conductive paths between devices to be cooled and a cold plate. The thermal bridge elements are disks progressively stacked and having bulge shapes and radial finger contacts for providing multiple compliant heat conduction paths between each device and a cold plate.
Thermal Conduction Element For Semiconductor Devices
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2336
US Classification:
165185
Abstract:
A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.
Joseph L. Horvath - Poughkeepsie NY Robert G. Biskeborn - Pawling NY Carl Yakubowski - Hyde Park NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
F28F 500 F28F 700
US Classification:
357 81
Abstract:
An apparatus for removing heat from a heat generating device. The apparatus includes at least one heat conductive finned thermal device insert including a base having at least one first fin, and preferably haing a plurality of first fins, on a first surface and a second surface which is flat and a heat conductive second thermal device, preferably a cooling hat, having a plurality of second fins. The first fins are interspersed with the second fins. At least one of the first and second fins is of a thermally conductive, flexible material so that a gap otherwise existing between the interspersed fins is substantially eliminated. Finally, at least a portion of the first and second fins are biased against one another.
Thermal Conduction Element For Conducting Heat From Semiconductor Devices To A Cold Plate
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2336 H01L 2340
US Classification:
357 81
Abstract:
A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cover positioned in close proximity to the bridge element has an axially compressible spring member with a bulged central portion, a first flat plate member adapted to be placed in contact with the device, a second flat plate member adapted to be disposed in contact with the cold plate or cover, and a means to maintain the spring member, the first plate member and the second plate member in operative engagement.
Telescoping Thermal Conduction Element For Semiconductor Devices
Demetrios Balderes - Wappingers Falls NY Joseph L. Horvath - Poughkeepsie NY Lewis D. Lipschutz - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2340
US Classification:
165 80B
Abstract:
A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.