Joseph A Deangelo

US Patent:

20030074445, Apr 17, 2003

Filed:

Oct 17, 2001

Appl. No.:

09/981666

Inventors:

Wayne Roach - Bowie MD, US
Joseph DeAngelo - Mount Laurel NJ, US
Gil Pascal - Frederick MD, US

Assignee:

Velcero Broadband Applications, LLC

International Classification:

G06F015/173

US Classification:

709/224000

Abstract:

A broadband network system configured to transfer user datagram protocol with value-added (UDPVA) packet from to a broadband interface unit (BIntU) transceiver. The broadband network system may comprise a data distribution center and the BIntU transceiver. The BIntU transceiver is configured to generate the UDPVA packet. The BIntU transceiver includes an encoder/decoder (codec) configured to alternatively code or decode UDP frame information and a digital signal processor (DSP) portion. The DSP portion is coupled to the codec. In one aspect, the DSP portion includes a stack that temporarily stores the UDPVA packet within the stack. In one aspect, the UDPVA packet is in a form to be transmitted directly to a network destination address device. In another aspect, the UDPVA packet is available to delivery to a network destination address or storage located on a local area network or a wide area network. In certain aspects, the BIntU transceiver is configured to transmit the UDPVA packet to the data distribution center.

US Patent:

20030074474, Apr 17, 2003

Filed:

Oct 17, 2001

Appl. No.:

09/981301

Inventors:

Wayne Roach - Bowie MD, US
Joseph DeAngelo - Mount Laurel NJ, US
Gil Pascal - Frederick MD, US

International Classification:

G06F015/173

US Classification:

709/246000, 709/232000

Abstract:

A data distribution center associated with a broadband network system wherein the first broadband network system further includes at least one broadband interface unit (BIntU) transceiver comprising a receiver portion and a transmitter portion. The receiver portion is configured to receive user defined protocol with value-added (UDPVA) packet from the BIntU transceiver. The transmitter portion is configured to transmit return packets that is triggered in response to the UDPVA packets, wherein the data distribution center indicates to the BIntU transceiver that the UDPVA packets forwarded by the BIntU transceiver to the data distribution center are being received by the data distribution center or a second BIntU transceiver.

US Patent:

20030074554, Apr 17, 2003

Filed:

Oct 17, 2001

Appl. No.:

09/981283

Inventors:

Wayne Roach - Bowie MD, US
Joseph DeAngelo - Mount Laurel NJ, US
Gil Pascal - Frederick MD, US

International Classification:

H04L009/00

US Classification:

713/153000

Abstract:

A first broadband interface unit (BIntU) transceiver that is associated with a broadband network system wherein the first broadband network system further includes a data distribution center. The first BIntU transceiver comprising a transmitter portion. The transmitter portion is configured to transmit user defined protocol with value-added (UDPVA) packet to the data distribution center. The first BIntU transceiver is configured to interface with the data distribution center or a second BIntU transceiver to indicate that the UDPVA packets are transmitted from the first BIntU transceiver to the data distribution center or the second BIntU transceiver are being received respectively by the data distribution center or by the second BIntU transceiver.

US Patent:

20120065761, Mar 15, 2012

Filed:

May 17, 2010

Appl. No.:

13/321017

Inventors:

Ivy Wei Qin - Lansdale PA, US
Ray L. Cathcart - Elkins Park PA, US
Cuong Huynh - Radnor PA, US
Deepak Sood - New Britain PA, US
Paul W. Sucro - Hatfield PA, US
Joseph O. DeAngelo - Winters CA, US

Assignee:

KULICKE AND SOFFA INDUSTRIES, INC. - Fort Washington PA

International Classification:

G06F 17/00

US Classification:

700103, 700108

Abstract:

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).