John Timothy Spann

US Patent:

20120211068, Aug 23, 2012

Filed:

Feb 21, 2012

Appl. No.:

13/401181

Inventors:

Arthur Cornfeld - Sandia Park NM, US
John Spann - Albuquerque NM, US
Pravin Patel - Albuquerque NM, US
Mark A. Stan - Albuquerque NM, US
Benjamin Cho - Albuquerque NM, US
Paul R. Sharps - Albuquerque NM, US
Daniel J. Aiken - Cedar Crest NM, US

Assignee:

Emcore Solar Power, Inc. - Albuquerque NM

International Classification:

H01L 31/0248
H01L 31/0304
H01L 31/18
H01L 31/04

US Classification:

136255, 438 74, 257E31054

Abstract:

A multijunction solar cell including an upper first solar subcell, and the base-emitter junction of the upper first solar subcell being a homojunction; a second solar subcell adjacent to said first solar subcell; a third solar subcell adjacent to said second solar subcell. A first graded interlayer is provided adjacent to said third solar subcell. A fourth solar subcell is provided adjacent to said first graded interlayer, said fourth subcell is lattice mismatched with respect to said third subcell. A second graded interlayer is provided adjacent to said fourth solar subcell; and a lower fifth solar subcell is provided adjacent to said second graded interlayer, said lower fifth subcell is lattice mismatched with respect to said fourth subcell.

US Patent:

20170085056, Mar 23, 2017

Filed:

Sep 19, 2016

Appl. No.:

15/268951

Inventors:

- Albuquerque NM, US
John Y. Spann - Albuquerque NM, US

Assignee:

Skorpios Technologies, Inc. - Albuquerque NM

International Classification:

H01S 5/022
H01S 5/34
G02B 6/12
H01S 5/343

Abstract:

A device for a gain medium for a semiconductor laser has an active region, a buffer layer, a substrate, and an etch stop between the buffer layer and the substrate. The device is bonded to a silicon platform having silicon devices, such as a waveguide and mirror. The substrate is removed, after bonding the device to the platform. The buffer layer is made of different material than the substrate to reduce undercut of the buffer layer during substrate removal compared to a buffer layer made of the same material as the substrate.

US Patent:

20160329454, Nov 10, 2016

Filed:

Jul 19, 2016

Appl. No.:

15/214315

Inventors:

- Albuquerque NM, US
Arthur Cornfeld - Sandy Springs GA, US
John Spann - Albuquerque NM, US
Mark A. Stan - Albuquerque NM, US
Benjamin Cho - Alburquerque NM, US
Paul R. Sharps - Alburquerque NM, US
Daniel J. Aiken - Cedar Crest NM, US

International Classification:

H01L 31/0725
H01L 31/0304
H01L 31/18
H01L 31/0735

Abstract:

A multijunction solar cell includes an upper first solar subcell having a first band gap, a second solar subcell having a second band gap smaller than the first band gap, and a first graded interlayer composed of (InxGa1-x)yAl1-yAs adjacent to the second solar subcell. The first graded interlayer has a third band gap greater than the second band gap subject to the constraints of having the in-plane lattice parameter greater or equal to that of the second subcell and less than or equal to that of the third subcell, wherein 0

US Patent:

20160274319, Sep 22, 2016

Filed:

Mar 18, 2016

Appl. No.:

15/073957

Inventors:

- Albuquerque NM, US
John Dallesasse - Geneva IL, US
Amit Mizrahi - San Francisco CA, US
Timothy Creazzo - Albuquerque NM, US
Elton Marchena - Albuquerque NM, US
John Y. Spann - Albuquerque NM, US

Assignee:

Skorpios Technologies, Inc. - Albuquerque NM

International Classification:

G02B 6/42
H01S 5/022
G02B 6/12

Abstract:

A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermetically seals the chip in the platform.

US Patent:

20160190378, Jun 30, 2016

Filed:

Feb 17, 2016

Appl. No.:

15/045641

Inventors:

- Albuquerque NM, US
Pravin Patel - Albuquerque NM, US
Mark A. Stan - Albuquerque NM, US
Benjamin Cho - Albuquerque NM, US
Paul R. Sharps - Alburquerque NM, US
Daniel J. Aiken - Cedar Crest NM, US
John Spann - Albuquerque NM, US

International Classification:

H01L 31/0687
H01L 31/078
H01L 31/18

Abstract:

A multijunction solar cell includes an upper first solar subcell, a second solar subcell adjacent to the first solar subcell, a third solar subcell adjacent to the second solar subcell, and a graded interlayer adjacent to the third solar subcell. The graded interlayer has a band gap that is greater than the band gap of the third solar subcell and is composed of a compositionally step-graded series of (InGa)AlAs layers with monotonically changing lattice constant, with x and y having respective values such that the band gap of the graded interlayer remains constant throughout its thickness, and wherein 0

US Patent:

20160133496, May 12, 2016

Filed:

Nov 5, 2015

Appl. No.:

14/933694

Inventors:

- Albuquerque MN, US
John Spann - Albuquerque NM, US
Stephen Krasulick - Albuquerque NM, US

Assignee:

SKORPIOS TECHNOLOGIES, INC. - Albuquerque NM

International Classification:

H01L 21/683
H01L 21/027
H01L 23/00

Abstract:

A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

US Patent:

20160013348, Jan 14, 2016

Filed:

Jul 30, 2015

Appl. No.:

14/813745

Inventors:

- Albuquerque NM, US
Pravin Patel - Albuquerque NM, US
Mark A. Stan - Albuquerque NM, US
Benjamin Cho - Albuquerque NM, US
Paul R. Sharps - Alburquerque NM, US
Daniel J. Aiken - Cedar Crest NM, US
John Spann - Albuquerque NM, US

International Classification:

H01L 31/0687

Abstract:

A multijunction solar cell having at least four solar subcells includes a first solar subcell having a first band gap, and a first graded interlayer adjacent to the first solar subcell, wherein the first graded interlayer has a second band gap greater than the first band gap and that is constant at 1.5 eV throughout the thickness of the first graded interlayer. A second solar subcell is adjacent to the first graded interlayer, wherein the second solar subcell has a third band gap smaller than the first band gap of the first solar subcell and wherein said second solar subcell is lattice mismatched with respect to the first solar subcell. A second graded interlayer is adjacent to the second solar subcell, wherein the second graded interlayer has a fourth band gap greater than the third band gap of the second solar subcell and that is constant at 1.1 eV throughout the thickness of the second graded interlayer. A third solar subcell is adjacent to the second graded interlayer, wherein the third solar subcell has a fifth band gap smaller than the third band gap of the second solar subcell and wherein the third solar subcell is lattice mismatched with respect to the second solar subcell. Each of the first and second graded interlayers is composed, respectively, of a compositionally step-graded series of (InGa)AlAs layers with monotonically changing lattice constant, with x and y having respective values such that the band gap of each interlayer remains constant throughout its thickness, and wherein 0

US Patent:

20150097210, Apr 9, 2015

Filed:

Oct 8, 2014

Appl. No.:

14/509971

Inventors:

- Albuquerque NM, US
John Dallesasse - Geneva IL, US
Amit Mizrahi - Albuquerque NM, US
Timothy Creazzo - Albuquerque NM, US
Elton Marchena - Albuquerque NM, US
John Y. Spann - Albuquerque NM, US

Assignee:

Skorpios Technologies, Inc. - Albuquerque NM

International Classification:

H01L 31/109
H01L 31/0203
H01L 31/0304

US Classification:

257184, 438 64

Abstract:

A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed.