John J Meagher

Author:

John C. Meagher

ISBN #:

0070737509

Author:

John C. Meagher

ISBN #:

0268003661

Author:

John C. Meagher

ISBN #:

0385266618

Author:

John C. Meagher

ISBN #:

0816402701

Author:

John C. Meagher

ISBN #:

0826410073

Author:

John C. Meagher

ISBN #:

0826412025

Author:

John C. Meagher

ISBN #:

0838639933

Author:

John C. Meagher

ISBN #:

0866836918

Address:

561 E Carpenter Dr, Palatine, IL 60074

Phone:

847 358-1196

VIN:

4T1BE46K67U021783

Make:

TOYOTA

Model:

CAMRY

Year:

2007

US Patent:

6907780, Jun 21, 2005

Filed:

Dec 1, 2003

Appl. No.:

10/725019

Inventors:

John T. Meagher - Hawthorn Woods IL, US

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01F023/00
G01F023/14
G01F023/185

US Classification:

73299, 73292, 73301

Abstract:

According to an exemplary embodiment, the present technique relates to a fuel sensor for determining operational fuel level (h) in a fuel tank (). In the exemplary embodiment, an isolated airspace () is created. By monitoring the pressure conditions in the isolated airspace as well as the pressure and temperature conditions in the remainder () of the tank (), the operational fuel level (h) may be determined.

US Patent:

7281421, Oct 16, 2007

Filed:

Jun 3, 2005

Appl. No.:

11/144549

Inventors:

Jeffrey Yin - Wheeling IL, US
John T. Meagher - Hawthorn Woods IL, US

Assignee:

Temic Automotive of North America, Inc. - Deer Park IL

International Classification:

G01M 17/02

US Classification:

731468, 731465

Abstract:

A tire pressure sensor assembly including a valve stem that can be preassembled and snap installed into a tire rim is disclosed. The tire pressure sensor assembly includes a valve stem and a printed circuit board configured with electronics for sensing tire pressure and transmitting radio frequency data related to tire pressure. The circuit board is rigidly connected to the valve stem. The valve stem and the electronics are contained in a unitary, integrated housing that is deformable to allow the valve stem portion of the assembly to be press fit into the rim opening. So installed, the assembly is securely mounted to the rim, but is no more time consuming to install than a conventional valve stem.

US Patent:

7284418, Oct 23, 2007

Filed:

Jun 3, 2005

Appl. No.:

11/144992

Inventors:

Jeffrey Yin - Wheeling IL, US
John T. Meagher - Hawthorn Woods IL, US

Assignee:

Temic Automotive of North America, Inc. - Deer Park IL

International Classification:

B60C 23/02
B60C 23/04
B60C 23/00

US Classification:

731468, 731463, 731462, 73146, 340438, 340443, 340445

Abstract:

The disclosure provides a tire pressure sensor assembly that includes a battery and a printed circuit board (PCB) configured with electronics to measure tire pressure and to transmit an electromagnetic signal related to the measured tire pressure. The PCB and battery are contained in a housing that allows the PCB and the battery to be angularly oriented with respect to each other. Such orientation permits the sensor to conform to the curved surface of the rim. An embodiment of the disclosed tire pressure sensor assembly is adapted to fasten to a valve stem via a metal terminal. The attachment configuration permits the valve stem assembly to deform as the valve stem is installed in a rim and also allows the valve stem to function as a portion of the antenna structure to facilitate transmitting the RF signal to a receiver.

US Patent:

D3626580, Sep 26, 1995

Filed:

Sep 28, 1994

Appl. No.:

D/029039

Inventors:

John Meagher - Hawthorn Woods IL
Youngkee Ahn - Buffalo Grove IL

Assignee:

Motorola, Inc. - Schaumburg IL

US Classification:

D13147

US Patent:

61942464, Feb 27, 2001

Filed:

Aug 25, 1999

Appl. No.:

9/382943

Inventors:

David Joseph Anderson - Oak Lawn IL
John Thomas Meagher - Hawthorn Woods IL

Assignee:

Motorola Inc. - Schaumburg IL

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438106

Abstract:

A process for fabricating an electronic module (30) and a packaged electronic device (56) having a thermally conductive substrate includes the step of thermally spraying of a dielectric layer (12) onto a baseplate (10). An electrically conductive layer (18) is then direct bonded to the thermally sprayed dielectric layer. The thermally sprayed dielectric layer can be formed at selected locations on the upper surface of the baseplate (10) by forming a pattern on the upper surface prior to carrying out the thermal spraying process. The electrically conductive layer (18) is patterned to form an interconnect pattern overlying the baseplate. Because the thermal spraying process can form extremely thin dielectric layers, an electronic module (30) fabricated in accordance with the invention exhibits high heat transfer characteristics. A heat producing electronic component (24), such as a power transistor, can be attached to the electrically conductive layer (18), and the heat generated therefrom dissipated through the baseplate (10).