John R Jephson

US Patent:

49162608, Apr 10, 1990

Filed:

Oct 11, 1988

Appl. No.:

7/255310

Inventors:

Cynthia J. Broaddus - Binghamton NY
John R. Jephson - Endicott NY
Eugene M. Scales - Endicott NY
Carl C. Sissenstein - Endicott NY
John P. Wiley - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 100
H05K 300

US Classification:

174268

Abstract:

An electrically conductive circuit member for use within a multilayered circuit board assembly wherein the member comprises a sheet of electrically conductive material (e. g. , copper) and first and second layers of electrically insulative material (e. g. , prepreg) bonded thereto to substantially encapsulate the conductive material therein. The conductive material includes a plurality of apertures and a plurality of elongated openings, which openings are mechanically provided in a predefined pattern to assure at least two electrically isolated regions within the singular, planar conductive material. A method of making this circuit member is also defined, said method not requiring the need for wet/chemical processing and the disadvantages associated therewith.