John A Haven

US Patent:

6386829, May 14, 2002

Filed:

Jul 2, 1999

Appl. No.:

09/347078

Inventors:

John B. Haven - Sterling MA
Michael R. Kolk - Ashburnham MA

Assignee:

Power Technology, Incorporated - Fitchburg MA

International Classification:

F01D 102

US Classification:

415185

Abstract:

A steam turbine has multiple valves for introducing steam into a steam turbine. Each of the input valves introduce steam flow around the entire the 360 degree arc. The set of nozzles are each divided into a plurality of chambers. Each set of chambers extends around the full arc of the turbine. Each set has a valve. The chambers are designed so that all valves are open when the turbine is running at maximum output. The chambers are sized such that valve throttling losses are minimized when the turbine is at its normal operating condition.

US Patent:

42176174, Aug 12, 1980

Filed:

Sep 22, 1978

Appl. No.:

5/944761

Inventors:

Anthony J. Rossi - Fitchburg MA
Richard E. Lundberg - Ashby MA
Thomas A. Fancy - Westminster MA
Donald F. Behringer - Ashburnham MA
John B. Haven - Lunenburg MA

Assignee:

General Electric Company - Schenectady NY

International Classification:

H02H 706

US Classification:

361 51

Abstract:

The disclosure sets forth trip circuitry for a rotating shaft machine which includes redundant overspeed protection and means for testing the overspeed protection circuit while the machine remains in operation. Moreover, further protective circuitry is provided for detecting a failure in the speed sensing system. The overspeed protection and the speed sensing failure circuit are each connected to a relay system which may actuate a trip servo valve to a closed position.

US Patent:

20210359429, Nov 18, 2021

Filed:

May 15, 2020

Appl. No.:

16/874790

Inventors:

- Waltham MA, US
John P. Haven - Lowell MA, US
Channing P. Favreau - Barre MA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01Q 23/00
H01Q 9/04
H01Q 1/48
H01L 23/66

Abstract:

Methods and apparatus for providing a radiator having an antenna comprising a patch antenna layer and a first ground plane layer, wherein the antenna has a reactive field region of the radiator between the patch antenna layer and the first ground plane layer, and an integrated circuit located in the active region.

US Patent:

20210360772, Nov 18, 2021

Filed:

May 15, 2020

Appl. No.:

16/874794

Inventors:

- Waltham MA, US
John P. Haven - Lowell MA, US
James E. Benedict - Lowell MA, US
William J. Clark - Waltham MA, US
Channing P. Favreau - Barre MA, US
Erika Klek - Wilmington MA, US
Mikhail Pevzner - Woburn MA, US
Donald G. Hersey - Beverly MA, US
Gregory G. Beninati - Salem NH, US
Thomas J. Tellinghuisen - Pelham NH, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H05K 1/02
H05K 7/14
H01P 1/20

Abstract:

Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.

US Patent:

20210337651, Oct 28, 2021

Filed:

Jul 2, 2021

Appl. No.:

17/366836

Inventors:

- Waltham MA, US
Kevin Wilder - Derry NH, US
James Benedict - Tewksbury MA, US
Mary K. Herndon - Littleton MA, US
Thomas V. Sikina - Acton MA, US
John P. Haven - Lowell MA, US

International Classification:

H05K 1/02
H01Q 1/38
H01Q 1/52
H05K 3/00
H05K 3/30

Abstract:

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

US Patent:

20210296751, Sep 23, 2021

Filed:

Mar 18, 2020

Appl. No.:

16/822399

Inventors:

- Waltham MA, US
Erika Klek - Tewksbury MA, US
John P. Haven - Lowell MA, US
Michael Souliotis - Somerville MA, US
Thomas V. Sikina - Harvard MA, US
Andrew R. Southworth - Lowell MA, US
Kevin Wilder - Derry NH, US

International Classification:

H01P 5/08
H01P 3/08

Abstract:

A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

US Patent:

20210226343, Jul 22, 2021

Filed:

Jan 16, 2020

Appl. No.:

16/744774

Inventors:

- Waltham MA, US
John P. Haven - Lowell MA, US
Gregory M. Fagerlund - Peabody MA, US
James Benedict - Tewksbury MA, US
Andrew Southworth - Lowell MA, US
Kevin Wilder - Derry NH, US

International Classification:

H01Q 21/06
H01Q 9/04
B33Y 80/00
H01Q 1/38

Abstract:

An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.

US Patent:

20210151855, May 20, 2021

Filed:

Nov 14, 2019

Appl. No.:

16/683593

Inventors:

- Waltham MA, US
John P. Haven - Lowell MA, US
Kevin Wilder - Derry NH, US
James E. Benedict - Lowell MA, US
Andrew R. Southworth - Lowell MA, US
Mary K. Herndon - Littleton MA, US

International Classification:

H01Q 1/24
H01Q 21/00
H01Q 21/06
H01Q 1/52

Abstract:

A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.