A ceramic material which is an orthorhombic boride of the general formula: AlMgB :X, with X being a doping agent. The ceramic is a superabrasive, and in most instances provides a hardness of 40 GPa or greater.
Ductile Binder Phase For Use With A1Mgb14 And Other Hard Materials
This invention relates to a ductile binder phase for use with AlMgBand other hard materials. The ductile binder phase, a cobalt-manganese alloy, is used in appropriate quantities to tailor good hardness and reasonable fracture toughness for hard materials so they can be used suitably in industrial machining and grinding applications.
Ultra-Hard Boride-Based Metal Matrix Reinforcement
Bruce Allan Cook - Ankeny IA, US Alan Mark Russell - Ames IA, US Joel Lee Harringa - Ames IA, US S. Bulent Biner - Clive IA, US Iver Anderson - Ames IA, US
Assignee:
Iowa State University Research Foundation, Inc. - Ames IA
International Classification:
C22C 49/06
US Classification:
75244, 75249
Abstract:
A composite of M/AlMgBor M alloy/AlMgBis synthesized, where M=Al, Ti, W, or Cu. Small particles and/or fibers of AlMgBare distributed throughout a metal matrix to strengthen the resulting composite.
Ultra-Hard Low Friction Coating Based On A1Mgbfor Reduced Wear Of Mems And Other Tribological Components And System
Bruce Allan Cook - Ankeny IA, US Yun Tian - Ames IA, US Joel Lee Harringa - Ames IA, US Alan Paul Constant - Ames IA, US Alan Mark Russell - Ames IA, US Palaniappa A. Molian - Ames IA, US
Assignee:
Iowa State University Research Foundation, Inc. - Ames IA
International Classification:
B32B 15/20 C23C 14/34 C23C 14/16 C22C 21/00
US Classification:
428650, 428652, 428938, 20419216, 427250, 427554
Abstract:
Performance and reliability of microelectromechanical system (MEMS) components enhanced dramatically through the incorporation of protective thin film coatings. Current-generation MEMS devices prepared by the LIGA technique employ transition metals such as Ni, Cu, Fe, or alloys thereof, and hence lack stability in oxidizing, corrosive, and/or high temperature environments. Fabrication of a superhard, self-lubricating coating based on a ternary boride compound AlMgBis described in this letter as a potential breakthrough in protective coating technology for LIGA microdevices. Nanoindentation tests show that hardness of AlMgBfilms prepared by pulsed laser deposition ranges from 45 GPa to 51 GPa, when deposited at room temperature and 573 K, respectively. Extremely low friction coefficients of 0. 04-0. 05, which are thought to result from a self-lubricating effect, have also been confirmed by nanoscratch tests on the AlMgBfilms.
Wear-Resistant Boride Composites With High Percentage Of Reinforcement Phase
Bruce Allan Cook - Ankeny IA, US Joel Lee Harringa - Ames IA, US Alan Mark Russell - Ames IA, US Justin S. Peters - Ames IA, US Atiq Ahmed - Costa Mesa CA, US
Assignee:
Iowa State University Research Foundation, Inc. - Ames IA
International Classification:
C09K 3/14 C22C 29/00 C22C 29/12 C04B 35/00
US Classification:
51309, 75230, 75235, 501 963
Abstract:
A highly wear resistant sintered, hot pressed, or otherwise compacted ceramic composite material is described, consisting of two discrete phases of the form AlMgBwhere x and y ≦1 or like hard, orthorhombic compounds, and TiBor like Group IVB transition metal di-borides, and with an unexpectedly high content of transition metal di-boride in the range from 40 to 90 percent (28 to 85 volume percent).
Iver E. Anderson - Ames IA, US Joel Harringa - Ames IA, US Jason K. Walleser - Idaho Falls IA, US
International Classification:
B32B 15/01 C22C 13/00
US Classification:
428646, 420560, 428615, 228101, 420591
Abstract:
A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees C. A solder joint and solder process embody the solder alloy as well as solder balls and solder paste made therefrom to provide a solidified joint that includes three different intermetallic phases and a Sn metal phase. An exemplary Sn—Ag—Cu—Mn alloy consists essentially of about 3 to about 4 weight % Ag, about 0.80 to about 1.0 weight % Cu, and about 0.05 to about 0.15 weight % Mn, and balance consisting essentially of Sn.
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of AgSn blades.
Rare Earth-Doped Materials With Enhanced Thermoelectric Figure Of Merit
RESEARCH TRIANGLE INSTITUTE - Research Triangle Park NC, US Bruce Allen COOK - Ankeny IA, US Evgenii M. LEVIN - Ames IA, US Joel Lee HARRINGA - Ames IA, US
Assignee:
RESEARCH TRIANGLE INSTITUTE - Research Triangle Park NC
International Classification:
H01L 35/16
US Classification:
136238, 252500, 2525194
Abstract:
A thermoelectric material and a thermoelectric converter using this material. The thermoelectric material has a first component including a semiconductor material and a second component including a rare earth material included in the first component to thereby increase a figure of merit of a composite of the semiconductor material and the rare earth material relative to a figure of merit of the semiconductor material. The thermoelectric converter has a p-type thermoelectric material and a n-type thermoelectric material. At least one of the p-type thermoelectric material and the n-type thermoelectric material includes a rare earth material in at least one of the p-type thermoelectric material or the n-type thermoelectric material.
Technical Consultant Aug 2012 to 2000Quality Engineer, Wellman Dynamics Jul 2014 to Sep 2014Materials Laboratory Technical Supervisor, Wellman Dynamics Jan 2014 to Jul 2014United States Dept
Nov 1987 to Aug 2012 Assistant Scientist, Ames LaboratoryUnited Stated Patent and Trademark Office
1984 to 1986 Patent Examiner
Education:
Iowa State University 1997 M. S. in Materials Science and EngineeringIowa State University 1984 B. S. in Physics