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Joel Lee Harringa

age ~63

from Ames, IA

Also known as:
  • Joel L Harringa
  • Joel L Harringer
  • Harringa J Joel
Phone and address:
1226 Burnett Ave, Ames, IA 50010
515 233-4661

Joel Harringa Phones & Addresses

  • 1226 Burnett Ave, Ames, IA 50010 • 515 233-4661
  • Kensett, IA
  • 1226 Burnett Ave, Ames, IA 50010 • 319 330-4991

Work

  • Position:
    Technical consultant

Education

  • School / High School:
    Iowa State University
    1997
  • Specialities:
    M. S. in Materials Science and Engineering

Emails

Us Patents

  • Superabrasive Boride And A Method Of Preparing The Same By Mechanical Alloying And Hot Pressing

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  • US Patent:
    6432855, Aug 13, 2002
  • Filed:
    May 23, 2000
  • Appl. No.:
    09/576674
  • Inventors:
    Bruce A. Cook - Ankeny IA
    Joel L. Harringa - Ames IA
    Alan M. Russell - Ames IA
  • Assignee:
    Iowa State University Reseach Foundation, Inc,. - Ames IA
  • International Classification:
    C04B 3558
  • US Classification:
    501 963, 501 964, 501 984, 501 971, 501 972, 501 973, 501 985, 264299, 264319
  • Abstract:
    A ceramic material which is an orthorhombic boride of the general formula: AlMgB :X, with X being a doping agent. The ceramic is a superabrasive, and in most instances provides a hardness of 40 GPa or greater.
  • Ductile Binder Phase For Use With A1Mgb14 And Other Hard Materials

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  • US Patent:
    6921422, Jul 26, 2005
  • Filed:
    Sep 23, 2003
  • Appl. No.:
    10/669183
  • Inventors:
    Bruce A. Cook - Ankeny IA, US
    Alan Russell - Ames IA, US
    Joel Harringa - Ames IA, US
  • Assignee:
    Iowa State University Research Foundation, Inc. - Ames IA
  • International Classification:
    C22C029/00
    C22C029/14
    C09K003/14
  • US Classification:
    51307, 51308, 51309, 75235, 75236, 75240, 75230, 419 10, 419 12, 419 13, 419 14, 419 19, 420434, 420435
  • Abstract:
    This invention relates to a ductile binder phase for use with AlMgBand other hard materials. The ductile binder phase, a cobalt-manganese alloy, is used in appropriate quantities to tailor good hardness and reasonable fracture toughness for hard materials so they can be used suitably in industrial machining and grinding applications.
  • Ultra-Hard Boride-Based Metal Matrix Reinforcement

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  • US Patent:
    7172641, Feb 6, 2007
  • Filed:
    Jun 18, 2004
  • Appl. No.:
    10/871933
  • Inventors:
    Bruce Allan Cook - Ankeny IA, US
    Alan Mark Russell - Ames IA, US
    Joel Lee Harringa - Ames IA, US
    S. Bulent Biner - Clive IA, US
    Iver Anderson - Ames IA, US
  • Assignee:
    Iowa State University Research Foundation, Inc. - Ames IA
  • International Classification:
    C22C 49/06
  • US Classification:
    75244, 75249
  • Abstract:
    A composite of M/AlMgBor M alloy/AlMgBis synthesized, where M=Al, Ti, W, or Cu. Small particles and/or fibers of AlMgBare distributed throughout a metal matrix to strengthen the resulting composite.
  • Ultra-Hard Low Friction Coating Based On A1Mgbfor Reduced Wear Of Mems And Other Tribological Components And System

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  • US Patent:
    7238429, Jul 3, 2007
  • Filed:
    Sep 21, 2004
  • Appl. No.:
    10/946051
  • Inventors:
    Bruce Allan Cook - Ankeny IA, US
    Yun Tian - Ames IA, US
    Joel Lee Harringa - Ames IA, US
    Alan Paul Constant - Ames IA, US
    Alan Mark Russell - Ames IA, US
    Palaniappa A. Molian - Ames IA, US
  • Assignee:
    Iowa State University Research Foundation, Inc. - Ames IA
  • International Classification:
    B32B 15/20
    C23C 14/34
    C23C 14/16
    C22C 21/00
  • US Classification:
    428650, 428652, 428938, 20419216, 427250, 427554
  • Abstract:
    Performance and reliability of microelectromechanical system (MEMS) components enhanced dramatically through the incorporation of protective thin film coatings. Current-generation MEMS devices prepared by the LIGA technique employ transition metals such as Ni, Cu, Fe, or alloys thereof, and hence lack stability in oxidizing, corrosive, and/or high temperature environments. Fabrication of a superhard, self-lubricating coating based on a ternary boride compound AlMgBis described in this letter as a potential breakthrough in protective coating technology for LIGA microdevices. Nanoindentation tests show that hardness of AlMgBfilms prepared by pulsed laser deposition ranges from 45 GPa to 51 GPa, when deposited at room temperature and 573 K, respectively. Extremely low friction coefficients of 0. 04-0. 05, which are thought to result from a self-lubricating effect, have also been confirmed by nanoscratch tests on the AlMgBfilms.
  • Wear-Resistant Boride Composites With High Percentage Of Reinforcement Phase

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  • US Patent:
    7517375, Apr 14, 2009
  • Filed:
    Jan 4, 2006
  • Appl. No.:
    11/325292
  • Inventors:
    Bruce Allan Cook - Ankeny IA, US
    Joel Lee Harringa - Ames IA, US
    Alan Mark Russell - Ames IA, US
    Justin S. Peters - Ames IA, US
    Atiq Ahmed - Costa Mesa CA, US
  • Assignee:
    Iowa State University Research Foundation, Inc. - Ames IA
  • International Classification:
    C09K 3/14
    C22C 29/00
    C22C 29/12
    C04B 35/00
  • US Classification:
    51309, 75230, 75235, 501 963
  • Abstract:
    A highly wear resistant sintered, hot pressed, or otherwise compacted ceramic composite material is described, consisting of two discrete phases of the form AlMgBwhere x and y ≦1 or like hard, orthorhombic compounds, and TiBor like Group IVB transition metal di-borides, and with an unexpectedly high content of transition metal di-boride in the range from 40 to 90 percent (28 to 85 volume percent).
  • Pb-Free Sn-Ag-Cu-Mn Solder

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  • US Patent:
    20100203353, Aug 12, 2010
  • Filed:
    Jun 23, 2009
  • Appl. No.:
    12/456853
  • Inventors:
    Iver E. Anderson - Ames IA, US
    Joel Harringa - Ames IA, US
    Jason K. Walleser - Idaho Falls IA, US
  • International Classification:
    B32B 15/01
    C22C 13/00
  • US Classification:
    428646, 420560, 428615, 228101, 420591
  • Abstract:
    A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees C. A solder joint and solder process embody the solder alloy as well as solder balls and solder paste made therefrom to provide a solidified joint that includes three different intermetallic phases and a Sn metal phase. An exemplary Sn—Ag—Cu—Mn alloy consists essentially of about 3 to about 4 weight % Ag, about 0.80 to about 1.0 weight % Cu, and about 0.05 to about 0.15 weight % Mn, and balance consisting essentially of Sn.
  • Pb-Free Sn-Ag-Cu-Al Or Sn-Cu-Al Solder

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  • US Patent:
    20110303448, Dec 15, 2011
  • Filed:
    Apr 22, 2011
  • Appl. No.:
    13/066748
  • Inventors:
    Iver E. Anderson - Ames IA, US
    Joel L. Harringa - Ames IA, US
    Adam J. Boesenberg - Ames IA, US
  • International Classification:
    H05K 1/02
    H01R 4/02
    B23K 35/14
    C22C 13/00
    B23K 31/02
  • US Classification:
    174259, 420560, 228101, 228 563, 174 84 R
  • Abstract:
    A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of AgSn blades.
  • Rare Earth-Doped Materials With Enhanced Thermoelectric Figure Of Merit

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  • US Patent:
    20130186449, Jul 25, 2013
  • Filed:
    Dec 21, 2012
  • Appl. No.:
    13/725156
  • Inventors:
    RESEARCH TRIANGLE INSTITUTE - Research Triangle Park NC, US
    Bruce Allen COOK - Ankeny IA, US
    Evgenii M. LEVIN - Ames IA, US
    Joel Lee HARRINGA - Ames IA, US
  • Assignee:
    RESEARCH TRIANGLE INSTITUTE - Research Triangle Park NC
  • International Classification:
    H01L 35/16
  • US Classification:
    136238, 252500, 2525194
  • Abstract:
    A thermoelectric material and a thermoelectric converter using this material. The thermoelectric material has a first component including a semiconductor material and a second component including a rare earth material included in the first component to thereby increase a figure of merit of a composite of the semiconductor material and the rare earth material relative to a figure of merit of the semiconductor material. The thermoelectric converter has a p-type thermoelectric material and a n-type thermoelectric material. At least one of the p-type thermoelectric material and the n-type thermoelectric material includes a rare earth material in at least one of the p-type thermoelectric material or the n-type thermoelectric material.

Resumes

Joel Harringa Photo 1

Joel Harringa Ames, IA

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Work:
Technical Consultant
Aug 2012 to 2000
Quality Engineer, Wellman Dynamics
Jul 2014 to Sep 2014
Materials Laboratory Technical Supervisor, Wellman Dynamics
Jan 2014 to Jul 2014
United States Dept

Nov 1987 to Aug 2012
Assistant Scientist, Ames Laboratory
United Stated Patent and Trademark Office

1984 to 1986
Patent Examiner
Education:
Iowa State University
1997
M. S. in Materials Science and Engineering
Iowa State University
1984
B. S. in Physics

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