Jerry S Cupples

US Patent:

46859985, Aug 11, 1987

Filed:

Oct 9, 1986

Appl. No.:

6/917040

Inventors:

Wayne A. Mulholland - Plano TX
Robert H. Bond - Carrollton TX
Michael A. Olla - Flower Mound TX
Jerry S. Cupples - Carrollton TX
Barbara R. Mozdzen - Carrollton TX
Charles F. Held - The Colony TX
Linda S. Wilson - Pilot Point TX
Yen T. Nguyen - Grand Prarie TX

Assignee:

Thomson Components - Mostek Corp. - Carrollton TX

International Classification:

B44C 122
B29C 3700
H01L 2348
H01L 2944

US Classification:

156633

Abstract:

An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

US Patent:

47220600, Jan 26, 1988

Filed:

Mar 22, 1984

Appl. No.:

6/592144

Inventors:

Daniel J. Quinn - Carrollton TX
Robert H. Bond - Carrollton TX
Wayne A. Mulholland - Plano TX
Steven Swendrowski - The Colony TX
Michael A. Olla - Flower Mound TX
Jerry S. Cupples - Carrollton TX
Barbara R. Mozdzen - Carrollton TX
Linda S. Wilson - Pilot Point TX
Linn Garrison - Garland TX

Assignee:

Thomson Components-Mostek Corporation - Carrollton TX

International Classification:

H01R 909
H01L 2300

US Classification:

364490

Abstract:

A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.