30750 southwest Peach Cove Rd, West Linn, OR 97068
Industry:
Semiconductors
Work:
Esi
Senior Mechanical Engineer
Semitool 1997 - 2000
Mechanical Engineer
Education:
Montana State University - Bozeman 1993 - 1997
Bachelors, Bachelor of Science, Mechanical Engineering
Montana Tech - College of Technology 1992 - 1993
Brady High School
Skills:
Mechanical Engineering Design of Experiments Metrology Engineering Management Semiconductors Failure Analysis Design For Manufacturing R&D Engineering Simulations Automation Lean Manufacturing Optics Semiconductor Industry Fmea Labview Laser
Mark T. Kosmowski - Beaverton OR, US Robert Ferguson - Beaverton OR, US Jeremy Willey - Portland OR, US
Assignee:
Electro Scientific Industries, Inc. - Portland OR
International Classification:
G03B 27/58
US Classification:
355 72, 355 53
Abstract:
A specimen inspection stage implemented with a processing stage coupling mechanism provides a capability to conduct with maximum efficiency post-processing specimen inspections on-board a processing platform. Heavy inspection equipment is mounted on a specimen inspection stage that is separate from a processing stage. In a preferred embodiment, the processing stage moves in response to an applied motive force and performs laser-based processing operations on a specimen. While laser processing is ongoing, the specimen inspection stage remains parked in its home position. When it is time for post-processing inspection, a stage coupling and decoupling mechanism couples together the specimen inspection stage and the processing stage, which transports the specimen inspection stage to and from the specimen position.
Dry Contact Assemblies, Methods For Making Dry Contact Assemblies, And Plating Machines With Dry Contact Assemblies For Plating Microelectronic Workpieces
John Pedersen - Kalispell MT, US Jeremy Willey - Portland OR, US Daniel Woodruff - Kalispell MT, US
International Classification:
C25D017/00
US Classification:
204/222000, 204/279000
Abstract:
Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system carried by the support member. The support member, for example, can be a ring or another structure that has an opening configured to receive the workpiece. In one embodiment, the support member is a conductive ring. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member. The contact members can comprise electrically conductive biasing elements that have contact sites and the contact members can also have a dielectric coating covering at least a portion of the biasing elements. The contact system can also have a shield carried by the support member and a seal on the lip of the shield. The shield and seal are configured to prevent electroplating solution from engaging the contact members.
Method And Apparatus For Collecting Material Produced By Processing Workpieces
Jeremy Alan Willey - Tualatin OR, US Steven Albert Supalla - Portland OR, US
Assignee:
ELECTRO SCIENTIFIC INDUSTRIES, INC. - Portland OR
International Classification:
A47L 9/00
US Classification:
153001
Abstract:
An apparatus for collecting material from a workpiece from a machined workpiece includes a fluid nozzle for inducing a flow of a fluid and a collection nozzle. The collection nozzle includes a motive nozzle for accelerating a first portion of the fluid flow; and an induced-suction nozzle for receiving a second portion of the fluid flow. A suction force can be generated within a vicinity of the induced-suction nozzle based on the accelerated first portion of the fluid flow. The suction force can be sufficient to carry at least a portion of the material away from the workpiece. Related methods of collecting material from a workpiece are also disclosed, as are systems capable of incorporating the material apparatus collecting apparatus.
Frame And Exterior Shrouding For Laser Processing System
- Portland OR, US Jeremy Willey - Portland OR, US Brandon Bilyeu - APO, DE Wayne Crowther - Portland OR, US Chris Ryder - Portland OR, US
International Classification:
B23K 26/12 B23K 26/70 B23K 37/00
Abstract:
A frame for a laser processing module can be characterized as including a platform having an upper surface and a lower surface, an optics bridge spaced apart from, and extending over, the upper surface of the platform and a bridge support interposed between, and coupled to, the platform and the optics bridge. At least one selected from the group consisting of the platform and the optics bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to one another by the core and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second port formed at the exterior of the sandwich panel and in fluid communication with the at least one channel.
Laser Systems And Methods For Large Area Modification
A laser system () modifies a large area on an article () by employing a beamlet generator () to provide a plurality of beamlets () to a beamlet selection device () whose operation is synchronized with movement of a beam steering system () to variably select a number and spatial arrangement of beamlets () to propagate a variable pattern of spot areas () to the article ().