Jeffrey V Gasa from Lawrence, MA, age 45

Wafer Backside Coating Containing Reactive Sulfur Compound
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US Patent:

20130101856, Apr 25, 2013
Filed:

Dec 7, 2012
Appl. No.:

13/707803
Inventors:

Henkel Corporation - Rocky Hill CT, US
Shengqian Kong - Hillsborough NJ, US
Jeffrey Gasa - Long Beach CA, US
Jeffrey Leon - Long Beach CA, US
Dung Nghi Phan - Long Beach CA, US
Assignee:

Henkel Corporation - Rocky Hill CT
International Classification:

C09D 163/04
US Classification:

428413, 522 8
Abstract:

A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.

Dual Cure Adhesives
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US Patent:

20130102698, Apr 25, 2013
Filed:

Dec 7, 2012
Appl. No.:

13/707891
Inventors:

HENKEL CORPORATION - ROCKY HILL CT, US
JEFFREY GASA - LONG BEACH CA, US
DUNG NGHI PHAN - LONG BEACH CA, US
GYANENDRA DUTT - GARDEN GROVE CA, US
Assignee:

HENKEL CORPORATION - ROCKY HILL CT
International Classification:

C09J 163/04
US Classification:

522 18
Abstract:

This invention is a dual cure adhesive that can be designed to have a proper balance of properties by choosing formulation materials to meet certain inequalities. The dual cure adhesive comprises ethylenically unsaturated compounds capable of UV-initiated free radical polymerization and epoxy compounds and their corresponding curing agents capable of thermal cure. In a particular embodiment, the dual cure adhesive comprises (A) one or more monofunctional acrylate compounds containing an oxygen-containing cyclic unit, (B) one or more monofunctional acrylate compounds in which the ester group contains a hydrocarbon group consisting of at least six carbon atoms, and (C) one or more thermoplastic, solid, amorphous epoxy compounds having a softening point or melting point between 60 C. and 100 C.

Use Of Repellent Material To Protect Fabrication Regions In Semi Conductor Assembly
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US Patent:

20140113435, Apr 24, 2014
Filed:

Jan 2, 2014
Appl. No.:

14/146101
Inventors:

- Rocky Hill CT, US
Jeffrey Gasa - Long Beach CA, US
Kenji Kuriyama - Yokohama, JP
Hoseung Yoo - Cypress CA, US
Assignee:

HENKEL US IP LLC - Rocky Hill CT
International Classification:

H01L 21/78
H01L 21/683
US Classification:

438462
Abstract:

A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.

Jeffrey V Gasa