Jeffery J Kokovitch

US Patent:

6369345, Apr 9, 2002

Filed:

Aug 18, 2000

Appl. No.:

09/641665

Inventors:

Andrew W. Zaloga - Chandler AZ
Carolyn M. Stokman - Phoenix AZ
Jeffery J. Kokovitch - Gilbert AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 1005

US Classification:

219 8513, 2281791, 2282481

Abstract:

A method and apparatus for coupling a microelectronic component ( ) to a printed circuit board ( ) are disclosed. The component ( ) is coupled to the circuit board ( ) by placing leads ( ) of component ( ) in contact with conducting pads ( ) on the circuit board ( ), dispensing a bead of solder paste ( ) onto the leads ( ), and applying heat to the applied paste ( ) to cause the solder to reflow. The solder bead is dispensed using a solder paste dispenser ( ) and heated using a light source ( ).