Allan H. Clauer - Worthington OH Steven M. Toller - Grove City OH Jeffrey L. Dulaney - Dublin OH
Assignee:
LSP Technologies, Inc. - Dublin OH
International Classification:
B23K 2600
US Classification:
21912184, 2191216, 21912185
Abstract:
An apparatus and method for providing a substantially debris-free laser beam path for use during laser shock processing. The method and apparatus include a system for removing debris from the laser beam path and a system for preventing debris from entering the laser beam path.
Jeffrey L. Dulaney - Dublin OH Allan H. Clauer - Worthington OH Steven M. Toller - Dublin OH Craig T. Walters - Powell OH
Assignee:
LSP Technologies, Inc. - Dublin OH
International Classification:
B23K 2600
US Classification:
21912174, 21912185
Abstract:
A laser processing method for processing a hidden surface of a workpiece, the hidden surface being disposed within a recess having an opening. The method includes inserting a reflective member into the recess and directing a pulse of coherent energy to reflect off of said reflective member and impact the hidden surface of a workpiece to create a shock wave. Alteratively a surface of the recess may be modified to laser shock process the hidden surface. In one particular embodiment, the reflective member is specifically shaped toprovide diction of a pulse of coherent energy to a hidden surface so that a substantially uniform energy density is applied to the hidden surface. In an additional embodiment, the method is optimized for preventing damage to the reflective member. In one particular embodiment, the reflective member is composed of a fluid.
Mark E. OLoughlin - Galloway OH Allan H. Clauer - Worthington OH David W. Sokol - Dublin OH Jeffrey L. Dulaney - Dublin OH Steven M. Toller - Grove City OH
Assignee:
LSP Technologies, Inc. - Dublin OH
International Classification:
G01B 1100
US Classification:
356388, 356 32, 427554, 148510
Abstract:
A method of testing the operation of a laser peening system includes providing a sensor in a possible laser beam path, applying a transparent overlay material to the sensor, directing a pulse of coherent energy to the sensor through the transparent overlay material to create a shock wave, and determining a characteristic of the created shock wave with the sensor.
Allan H. Clauer - Worthington OH Steven M. Toller - Grove City OH Jeffrey L. Dulaney - Dublin OH
Assignee:
LSP Technologies, Inc. - Dublin OH
International Classification:
B23K 2600
US Classification:
2191216, 21912184, 21912185, 21912161, 21912162
Abstract:
An apparatus and method for providing a substantially debris-free laser beam path for use during laser shock processing. The method and apparatus include a system for removing debris from the laser beam path and a system for preventing debris from entering the laser beam path.
Quality Control Plasma Monitor For Laser Shock Processing
David W. Sokol - Dublin OH Craig T. Walters - Powell OH Harold M. Epstein - Columbus OH Allan H. Clauer - Worthington OH Jeffrey L. Dulaney - Dublin OH Mark OLoughlin - Galloway OH
Assignee:
LSP Technologies, Inc. - Dublin OH
International Classification:
C21D 154
US Classification:
148508, 266 99
Abstract:
A method and apparatus for quality control of laser shock processing. The method includes measuring emissions and characteristics of a workpiece when subjected to a pulse of coherent energy from a laser. These empirically measured emissions and characteristics of the workpiece are correlated to theoretical shock pressure, residual stress profile, or fatigue life of the workpiece. The apparatus may include a radiometer or acoustic detection device for measuring these characteristics.
Jeffrey L. Dulaney - Dublin OH Mark E. OLoughlin - Galloway OH Allan H. Clauer - Worthington OH
Assignee:
LSP Technologies, Inc. - Dublin OH
International Classification:
G06K 900
US Classification:
382151, 21912185
Abstract:
An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.
Laser Peening Process And Apparatus With Uniform Pressure Pulse Confinement
Jeffrey L. Dulaney - Dublin OH Allan H. Clauer - Worthington OH Steven M. Toller - Grove City OH
Assignee:
LSP Technologies, Inc. - Dublin OH
International Classification:
B23K 2600
US Classification:
21912184
Abstract:
A method and apparatus for improving properties of a solid material by providing shock waves therethrough. Laser shock processing is used to provide the shock waves. The method includes applying a transparent overlay to the solid material to be worked. The solid material or overlay is vibrated to release any gas bubbles or solid debris within the transparent layer which could cause localized non-uniform confinement of a pressure pulse applied for a workpiece thereby causing irregularities in the workpiece surface. A pulse of coherent laser energy is the directed to the coated portion of the solid material to create a shock wave. Additionally, the method may include adding a wetting agent or controlling the temperature of the overlay material to reduce the concentration of gas bubbles therein.
Steven M. Toller - Grove City OH Jeffrey L. Dulaney - Dublin OH Allan H. Clauer - Worthington OH Mark E. O'Loughlin - Galloway OH
Assignee:
LSP Technologies, Inc. - Dublin OH
International Classification:
B23K 2600 B23K 2616
US Classification:
21912186
Abstract:
An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator located therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.