Jay W Kokas

US Patent:

8542490, Sep 24, 2013

Filed:

Jun 16, 2011

Appl. No.:

13/161842

Inventors:

Jay W. Kokas - East Granby CT, US
Kevin P. Roy - West Springfield MA, US
Judy Schwartz - Longmeadow MA, US
Michael Maynard - Springfield MA, US
John D. Pennell - Enfield CT, US
Matthew S. Fitzpatrick - Portland CT, US
Richard M. Speziale - Winsted CT, US

Assignee:

Hamilton Sundstrand Corporation - Windsor Locks CT

International Classification:

H05K 7/20

US Classification:

361715, 36167954, 361708, 361721, 361704, 165 803, 16510433, 165185

Abstract:

A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.

US Patent:

8638535, Jan 28, 2014

Filed:

Jan 10, 2011

Appl. No.:

12/987219

Inventors:

Kevin P. Roy - West Springfield MA, US
Richard A. Poisson - Avon CT, US
Jay W. Kokas - East Granby CT, US
Edward John Marotta - Longmeadow MA, US
Robert C. Hoeckele - Granby CT, US
Luke T. Orsini - Marlborough CT, US
Marc S. McCloud - Suffield CT, US
Matthew S. Fitzpatrick - Portland CT, US

Assignee:

Hamilton Sundstrand Corporation - Windsor Locks CT

International Classification:

H02H 3/22

US Classification:

361111

Abstract:

A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0. 015 inches (or 0. 381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.

US Patent:

20110087343, Apr 14, 2011

Filed:

Jun 1, 2010

Appl. No.:

12/791163

Inventors:

Jeffry K. Kamenetz - Windsor CT, US
Gregory DiVincenzo - Putnam CT, US
Mark A. Johnston - Windsor CT, US
Jay W. Kokas - East Granby CT, US
Luke T. Orsini - Marlborough CT, US
Steven R. Fischer - North Granby CT, US
Jay H. Hartman - New Hartford CT, US
Kevin P. Roy - West Springfield MA, US
William Betterini - Rocky Hill CT, US

International Classification:

G05B 9/03

US Classification:

700 82

Abstract:

An electronic control configuration includes at least one secondary microprocessor operable to control a device. The at least one secondary microprocessor assumes protection control of the device responsive to a first type of failure by transmitting a protection control signal to a first effector. The at least one secondary microprocessor assumes backup control of the device responsive to a second type of failure by transmitting a backup control signal to a second effector. The backup control functionality of the at least one secondary microprocessor can be selectively disabled.

US Patent:

20130093270, Apr 18, 2013

Filed:

Oct 18, 2011

Appl. No.:

13/275914

Inventors:

Jay W. Kokas - East Granby CT, US
Richard E. Versailles - New Hartford CT, US
Robert D. Klapatch - Wethersfield CT, US
Michael Maynard - Springfield MA, US
Kerry R. Querns - Durham CT, US

Assignee:

HAMILTON SUNDSTRAND CORPORATION - Windsor Locks CT

International Classification:

H02K 9/00

US Classification:

310 52

Abstract:

A motor controller for use in an environment at a high maximum environmental temperature comprises an insulated chassis, a high-temperature capable electronic component, a low-temperature capable electronic component, and a heat pump. The high-temperature capable electronic component is rated for temperatures higher than the environmental temperature, whereas the low-temperature capable electronic component is rated for temperatures lower than the maximum environmental temperature. The insulated chassis has a finned surface to which the high-temperature capable electronic component is mounted. The low-temperature capable electronic component is attached to or integrated into a printed wiring board supported inside the insulated chassis by the thermally conductive posts. The heat pump is configured to draw heat from the low-temperature capable electronic component through the thermally conductive posts and a thermal spreader abutting the heat pump, and to expel heat into the finned surface of the insulating chassis.

US Patent:

20160186328, Jun 30, 2016

Filed:

Feb 19, 2014

Appl. No.:

14/183617

Inventors:

- Charlotte NC, US
Kevin M. Rankin - Windsor CT, US
Ricardo O. Brown - West Hartford CT, US
Jay W. Kokas - East Granby CT, US

Assignee:

Hamilton Sundstrand Corporation - Charlotte NC

International Classification:

C23C 18/38
C23C 18/16

Abstract:

A component is provided including a body formed at least partially from a composite material. At least a portion of the composite material is covered by a plating. The plating includes a layer of electroless copper, a layer of electrolytic copper, a layer of nickel strike, and a finishing layer.

US Patent:

20150000871, Jan 1, 2015

Filed:

Jul 1, 2013

Appl. No.:

13/932651

Inventors:

- Charlotte NC, US
Jay W. Kokas - East Granby CT, US
Kenneth J. Trotman - Granby CT, US
Kerry R. Querns - Durham CT, US

International Classification:

H05K 7/20

US Classification:

16510421

Abstract:

A device with increased heat dissipation abilities for supporting printed wiring boards includes a chassis for holding printed wiring boards, a plurality of fins attached to the chassis, and a heat pipe in each of the plurality of fins that is capable of transferring heat from the chassis to the surrounding ambient by absorbing heat from the chassis at a first end of the heat pipe and releasing the heat into the ambient at a second end of the heat pipe.

US Patent:

20150000961, Jan 1, 2015

Filed:

Jul 1, 2013

Appl. No.:

13/932699

Inventors:

- Charlotte NC, US
Jay W. Kokas - East Granby CT, US
Kenneth J. Trotman - Granby CT, US
Kerry R. Querns - Durham CT, US

International Classification:

H05K 1/02

US Classification:

174252

Abstract:

An apparatus includes a printed wiring board, a post that supports the printed wiring board, and a heat pipe on the printed wiring board with a first end positioned near an electronic component attached to the printed wiring board and a second end positioned near the post.

US Patent:

20140153191, Jun 5, 2014

Filed:

Dec 4, 2012

Appl. No.:

13/693494

Inventors:

- Windsor Locks CT, US
Kenneth J. Trotman - Granby CT, US
Jay W. Kokas - East Granby CT, US
Kerry R. Querns - Durham CT, US

Assignee:

HAMILTON SUNDSTRAND CORPORATION - Windsor Locks CT

International Classification:

H05K 7/20

US Classification:

361700

Abstract:

An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.