Jay S Greenspan

US Patent:

6476464, Nov 5, 2002

Filed:

Feb 15, 2000

Appl. No.:

09/504514

Inventors:

Jay Greenspan - South Dartmouth MA

Assignee:

Ixion, LLC - Fall River MA

International Classification:

H01J 500

US Classification:

257666, 257774, 257680, 257701, 257758, 257726, 257727, 428668, 428935, 428682, 439608, 174 52, 174 506, 174 57, 29879, 29884, 361248, 1022022, 1022025

Abstract:

The invention provides a lead structure having a lead of low resistance material disposed within a surrounding sleeve or collar of low expansion material which is bonded at one end to the lead. The sleeve or collar is bonded on its outer surface to an insulating wall through which the lead structure extends. The lead is preferably copper and the sleeve or collar is preferably a nickel-alloy. The lead is hermetically sealed to the surrounding sleeve, and the sleeve is hermetically sealed to the insulating wall to provide a hermetic structure which does not detract from the use of high conductivity electrical lead materials which are often not employable in conventional hermetic sealed leads or packages. A plurality of lead structures can be employed in one or more walls of a circuit package.

US Patent:

44879997, Dec 11, 1984

Filed:

Jan 10, 1983

Appl. No.:

6/457112

Inventors:

Phillips C. Baird - Lakeville MA
Jay S. Greenspan - South Dartmouth MA

Assignee:

Isotronics, Inc. - New Bedford MA

International Classification:

H05K 504

US Classification:

174 52S

Abstract:

An all-metal microwave chip carrier is provided with subminiature ceramic feedthroughs, each configured to function as a coaxial cable having a predetermined impedance. In one embodiment, the feedthroughs are formed by providing ceramic tubing metallized inside and out in which the ends are cut away to provide half-cylindrical bonding pads. In order to permit bonding directly to the feedthrough, a flat wire lead is soldered to the channel in the ceramic tube, with the ends of the flat wire extending onto the flat portions of the half-cylindrical portions of the feedthrough. In one embodiment, the chip carrier includes a base, ring, and stepped lid, all of Kovar or other suitable material, with the lid being weldable to the ring rather than being brazed or soldered.

US Patent:

60785012, Jun 20, 2000

Filed:

Dec 17, 1998

Appl. No.:

9/215580

Inventors:

John Catrambone - Carlisle MA
David Doiron - Ashburnham MA
Jay Greenspan - South Dartmouth MA
William Driscoll - Westford MA
Christopher Clarke - Nashua NH
Boris Semenov - Southborough MA

Assignee:

Omnirel LLC - Leominster MA

International Classification:

H05K 720

US Classification:

361704

Abstract:

An electronic module or package is disclosed for providing high reliability and high performance operation. The package comprises a hermetically sealed enclosure having a metallic baseplate and a ceramic cover, and containing one or more circuits or devices therein which typically are power rectifiers, bridges or power control circuitry. One or more power terminals are disposed on a terminal block compliantly supported on or above the baseplate, the terminals extending through the cover in hermetically sealed manner. Signal or control terminals may also be disposed on a terminal block compliantly supported on or above the baseplate, these terminals also extending through the cover in hermetically sealed manner. An adapter plate may be mounted on the cover and containing a plurality of terminals connected to the module terminals. The terminals of the adapter plate can be in any configuration to suit user requirements without requiring a change in the terminal configuration of the module itself.

US Patent:

44530331, Jun 5, 1984

Filed:

Mar 18, 1982

Appl. No.:

6/359209

Inventors:

Raymond J. Duff - North Dartmouth MA
Steven A. Tower - North Dartmouth MA
Jay S. Greenspan - South Dartmouth MA

Assignee:

Isotronics, Inc. - New Bedford MA

International Classification:

H05K 504

US Classification:

174 52FP

Abstract:

A microcircuit package in which one or more leads can be grounded to the package by a simple procedure which is performed on a package of usual construction. A braze preform is placed over a lead to be grounded, a metal washer is disposed over the lead and preform, and the assembly is brazed to cause fusing of the washer to the lead and to the header to provide a low resistance grounding connection between the lead and package.

US Patent:

51112779, May 5, 1992

Filed:

Mar 29, 1991

Appl. No.:

7/677078

Inventors:

Manuel Medeiros - Acushnet MA
Jay S. Greenspan - South Dartmouth MA

Assignee:

Aegis, Inc. - New Bedford MA

International Classification:

H01L 2302

US Classification:

357 74

Abstract:

A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.

US Patent:

51889854, Feb 23, 1993

Filed:

Apr 21, 1992

Appl. No.:

7/871446

Inventors:

Manuel Medeiros - Acushnet MA
Jay S. Greenspan - South Dartmouth MA

Assignee:

Aegis, Inc. - New Bedford MA

International Classification:

H01L 2160

US Classification:

437218

Abstract:

A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.

US Patent:

45476241, Oct 15, 1985

Filed:

Dec 2, 1983

Appl. No.:

6/557640

Inventors:

Steven A. Tower - North Dartmouth MA
Jay S. Greenspan - South Dartmouth MA

Assignee:

Isotronics, Inc. - New Bedford MA

International Classification:

H05K 504
H01L 3902

US Classification:

174 52FP

Abstract:

An offset weld ring is brazed or soldered to the top surface of a flat pack frame to provide an offset weld surface for the welding of a lid to the package in which the heat applied during the welding process is moved away from the glass feedthroughs in the package, thereby permitting closer spacing of the lid to the glass feedthrough for minimizing overall package height and obtaining a low profile package.

US Patent:

48558087, Aug 8, 1989

Filed:

Mar 25, 1987

Appl. No.:

7/030553

Inventors:

Steven A. Tower - North Dartmouth MA
Jay S. Greenspan - South Dartmouth MA

International Classification:

H01L 2308
H01L 2350
H01L 2330

US Classification:

357 74

Abstract:

A hermetically sealed glass chip carrier includes an outer glass ring and an inner glass base in which leads to the inner glass base pass between the ring and the base, with the ring, base and leads being sealed together by melting the glass in the vicinity of the seal. In one embodiment, the base includes a stepped annular lip with the leads protruding between the space between the base and the lip and onto the top surface of the lip. In an alternative embodiment, a Kovar substrate pad may be secured to the base. Complete hermetic sealing is accomplished through the use of a lid which contacts the top surface of the ring and is hermetically sealed thereto. The external leads may be formed and trimmed in various configurations to provide an elevated pad, a plug-in, or a socket-type configuration.

Author:

Jay Seth Greenspan

ISBN #:

0805206647

Author:

Jay Seth Greenspan

ISBN #:

0805237208

Author:

Jay Greenspan

ISBN #:

0312347839

Author:

Jay Greenspan

ISBN #:

0312347847

Author:

Jay Greenspan

ISBN #:

0764523473

Author:

Jay Greenspan

ISBN #:

0764535374

Author:

Jay Greenspan

ISBN #:

0764536346

Author:

Jay Greenspan

ISBN #:

0764537997