Jay P Gagnon

US Patent:

7166807, Jan 23, 2007

Filed:

Jun 3, 2005

Appl. No.:

11/144970

Inventors:

Jay Gagnon - Holden MA, US
Richard Dickinson - Manchester NH, US
Michael C. Doogue - Manchester NH, US
Andreas P. Friedrich - Epagny, FR
William P. Taylor - Amherst NH, US

Assignee:

Allegro Microsystems, Inc. - Worcester MA

International Classification:

H01L 23/495

US Classification:

174536, 324117 H, 324117 R, 324251

Abstract:

An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited proximate to a surface of the substrate and proximate to the one or more magnetic field sensors. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity. An insulating layer can be disposed between the current conductor portion and the substrate.

US Patent:

8461677, Jun 11, 2013

Filed:

Sep 23, 2011

Appl. No.:

13/241380

Inventors:

Virgil Ararao - Rutland MA, US
Nirmal Sharma - Shrewsbury MA, US
Raymond W. Engel - Southbridge MA, US
Jay Gagnon - Holden MA, US
John Sauber - Millbury MA, US
William P. Taylor - Amherst NH, US
Elsa Kam-Lum - Amherst NH, US

Assignee:

Allegro Microsystems, LLC - Worcester MA

International Classification:

H01L 23/04

US Classification:

257730, 257678, 257690, 257E23124, 257E23126

Abstract:

Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

US Patent:

8486755, Jul 16, 2013

Filed:

Dec 5, 2008

Appl. No.:

12/328798

Inventors:

Virgil Ararao - Rutland MA, US
Nirmal Sharma - Shrewsbury MA, US
Raymond W. Engel - Southbridge MA, US
Jay Gagnon - Holden MA, US
John Sauber - Millbury MA, US
William P. Taylor - Amherst NH, US
Elsa Kam-Lum - Amherst NH, US

Assignee:

Allegro Microsystems, LLC - Worcester MA

International Classification:

H01L 21/00

US Classification:

438106, 438 3, 438126, 257378, 257702

Abstract:

Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

US Patent:

20060219436, Oct 5, 2006

Filed:

May 12, 2006

Appl. No.:

11/383021

Inventors:

William Taylor - Amherst NH, US
Michael Doogue - Manchester NH, US
Nirmal Sharma - Shrewsbury MA, US
Jay Gagnon - Holden MA, US
Vijay Mangtani - Nashua NH, US

International Classification:

H01L 23/495

US Classification:

174529000

Abstract:

An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

US Patent:

20070279053, Dec 6, 2007

Filed:

Jul 11, 2007

Appl. No.:

11/776242

Inventors:

William Taylor - Amherst NH, US
John Cummings - Nashua NH, US
Michael Doogue - Manchester NH, US
Jay Gagnon - Holden MA, US
Vijay Mangtani - Nashua NH, US
Nirmal Sharma - Shrewsbury MA, US

International Classification:

G01R 33/02
G01R 33/07
G01R 33/09

US Classification:

324252000, 324244000

Abstract:

An integrated current sensor includes a current conductor, a magnetic field transducer, and an electromagnetic shield. The magnetic field transducer includes a sensor die. The electromagnetic shield is disposed proximate to the sensor die. The electromagnetic shield has at least one feature selected to reduce an eddy current in the electromagnetic shield.

US Patent:

52893448, Feb 22, 1994

Filed:

Oct 8, 1992

Appl. No.:

7/958496

Inventors:

Jay J. Gagnon - Holden MA
Paul J. Panaccione - Barre MA

Assignee:

Allegro Microsystems Inc. - Worcester MA

International Classification:

H05K 720

US Classification:

361712

Abstract:

The lead-frame in an integrated circuit package, a standard package designated SOT-89, has a plurality of leads of which at least one is an extension of a die-attach pad. At least one ground wing is formed as an extension of a peripheral portion of the die-attach pad and extends upward to approximately the plane of the top of the die. The ground wing has an upstanding portion and a horizontal portion that are at an angle to each other so as to lock the distal end of the wing in the body of encapsulating resin. An integrated circuit die having at least one electrical connection which is grounded electrically via a terminal and wire bonded to the distal part of the ground wing. A contact surface near the distal end of wing is positioned approximately in the plane of the top of the die. This ground circuit can parallel and can be redundant to a ground circuit through the die via the conductive bond that attaches the bottom of the die to the die-attach pad. The ground lead that is an extension of the die-attach pad serves both to remove heat from the die and to provide an electrical ground connection.

US Patent:

58593870, Jan 12, 1999

Filed:

Nov 29, 1996

Appl. No.:

8/758403

Inventors:

Jay J Gagnon - Holden MA

Assignee:

Allegro MicroSystems, Inc. - Worcester MA

International Classification:

H01L 2328

US Classification:

174 522

Abstract:

A semiconductor device includes a lead frame assembly having a die attach pad with a die secured by a die bonding material. A portion of the die bonding material may flow out from between the die and the die attach pad to form a squash out layer. A raised bond pad is at least partially in the squash out layer area and extends upward from said die attach pad sufficient to be above the squash out layer. A bond wire has one end secured to a ground terminal on the die and the other end to the raised bond pad. The whole structure is encapsulated in a plastic package.

US Patent:

49165062, Apr 10, 1990

Filed:

Nov 18, 1988

Appl. No.:

7/284003

Inventors:

Jay J. Gagnon - Holden MA

Assignee:

Sprague Electric Company - North Adams MA

International Classification:

H01L 2348

US Classification:

357 70

Abstract:

The lead-frame in an integrated circuit package, a dual-inline-package (DIP), has a plurality of leads of which four are extensions of a down-set die-attach pad. A dog-leg finger lines in the plane of the leads and is an extension of a peripheral portion of the die-attach pad. The dog-leg finger has first and second parts that are at right angles to each other so as to lock a distal port of it in the body of encapsulating resin. An integrated circuit die having at least one power transistor is grounded electrically via a terminal and wire bonded to the distal part of the dog-leg finger. This ground circuit parallels and is redundant to a ground circuit through the die via the conductive resin that attaches the bottom of the die to the die-attach pad, the later circuit having a relatively high electrical resistance. The four leads that are extensions of the die-attach pad serve both to remove heat from the die and to provide an electrical ground connection. The extending finger of dog-leg shape provides a point of ground-wire attachment that does not move relative to the encapsulating resin as do other peripheral parts of the die attach pad during temperature cycling.