Jason Michael Schaller

US Patent:

8481960, Jul 9, 2013

Filed:

Jun 23, 2011

Appl. No.:

13/167399

Inventors:

Svetlana Radovanov - Marblehead MA, US
Jason Schaller - Austin TX, US
Richard White - Newmarket NH, US
Kevin Verrier - Newmarket NH, US
James Blanchette - Haverhill MA, US
Eric Hermanson - Georgetown MA, US
Kevin Daniels - Lynnfield MA, US

Assignee:

Varian Semiconductor Equipment Associates, Inc. - Gloucester MA

International Classification:

G21K 1/08
H01J 3/14
H01J 3/26
H01J 49/42

US Classification:

250396R, 25049221, 25049223, 250326 R, 250423 R, 2504921, 2504922

Abstract:

A system and method are disclosed for controlling an ion beam. A deceleration lens is disclosed for use in an ion implanter. The lens may include a suppression electrode, first and second focus electrodes, and first and second shields. The shields may be positioned between upper and lower portions of the suppression electrode. The first and second shields are positioned between the first focus electrode and an end station of the ion implanter. Thus positioned, the first and second shields protect support surfaces of said first and second focus electrodes from deposition of back-streaming particles generated from said ion beam. In some embodiments, the first and second focus electrodes may be adjustable to enable the electrode surfaces to be adjusted with respect to a direction of the ion beam. By adjusting the angle of the focus electrodes, parallelism of the ion beam can be controlled. Other embodiments are described and claimed.

US Patent:

20080276867, Nov 13, 2008

Filed:

May 9, 2008

Appl. No.:

12/117945

Inventors:

Jason Schaller - Austin TX, US

International Classification:

C23C 16/00

US Classification:

118719

Abstract:

The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.

US Patent:

20080298945, Dec 4, 2008

Filed:

May 29, 2008

Appl. No.:

12/129346

Inventors:

Damon Keith Cox - Round Rock TX, US
Marvin L. Freeman - Round Rock TX, US
Jason M. Schaller - Austin TX, US
Jeffrey C. Hudgens - San Francisco CA, US
Jeffrey A. Brodine - Los Gatos CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B66C 23/18

US Classification:

4147447, 414800, 901 28

Abstract:

Methods and apparatus are provided for the use of a dual Selective Compliant Assembly Robot Arm (SCARA) robot. In some embodiments two SCARAs are provided, each including an elbow joint, wherein the two SCARAs are vertically stacked such that one SCARA is a first arm and the other SCARA is a second arm, and wherein the second arm is adapted to support a first substrate, and the first arm is adapted to extend to a full length when the second arm supports the first substrate, and wherein the first substrate supported by the second arm is coplanar with the elbow joint of the first arm, and the second arm is further adapted to move concurrently in parallel (and/or in a coordinated fashion) with the first arm a sufficient amount to avoid interference between the first substrate and the elbow joint of the first arm. Numerous other embodiments are provided.

US Patent:

20100089315, Apr 15, 2010

Filed:

Sep 21, 2009

Appl. No.:

12/563531

Inventors:

Karl M. Brown - Mountain View CA, US
Jason Schaller - Austin TX, US

Assignee:

APPLIED MATERIALS, INC. - Santa Clara CA

International Classification:

B05C 11/00

US Classification:

118504

Abstract:

A shutter disk suitable for shield a substrate support in a physical vapor deposition chamber is provided. In one embodiment, the shutter disk includes a disk-shaped body having an outer diameter disposed between a top surface and a bottom surface. The disk-shape body includes a double step connecting the bottom surface to the outer diameter.

US Patent:

20120325140, Dec 27, 2012

Filed:

Aug 20, 2012

Appl. No.:

13/589631

Inventors:

Jason Schaller - Austin TX, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 14/00

US Classification:

118 50

Abstract:

The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.

US Patent:

20130108406, May 2, 2013

Filed:

May 14, 2012

Appl. No.:

13/470809

Inventors:

Jason Schaller - Austin TX, US
Robert Vopat - Austin TX, US
Charles T. Carlson - Cedar Park TX, US
Aaron Webb - Austin TX, US
William T. Weaver - Austin TX, US

Assignee:

VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. - Gloucester MA

International Classification:

B66C 17/00
B66C 1/42
B66C 1/02

US Classification:

4147443, 414800

Abstract:

A system and method for receiving unprocessed workpieces, moving them, orienting them and placing them in a load lock, or other end point is disclosed. The system includes a gantry module for moving workpieces from a conveyor system to a swap module. The swap module is used to remove a carrier or matrix of processed workpieces from a load lock and place a carrier of matrix of unprocessed workpieces in its place. The processed workpieces are then moved by the gantry module back to the conveyor. The gantry module may have X, Y, Z and rotational actuators and include an end effector having multiple grippers. A method of aligning a plurality of workpieces on the end effector so that the plurality can be transported at the same time is also disclosed.

US Patent:

20130277999, Oct 24, 2013

Filed:

Apr 20, 2012

Appl. No.:

13/451598

Inventors:

Jason Schaller - Austin TX, US
Robert Brent Vopat - Austin TX, US

Assignee:

VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. - Gloucester MA

International Classification:

B25J 15/06
B25J 13/00

US Classification:

294186, 294183

Abstract:

A gripper system which utilizes two different suction systems is disclosed. This gripper system utilizes one suction system to pick up an item, while using the second suction system to hold the item. In some embodiments, a Venturi device based suction system is used as the first suction system to pick up the item, as this type of system is proficient at picking up items without requiring initial contact to create a seal. In some embodiments, a vacuum based system is used as the second suction system, as this type of system is able to hold items cost effectively.

US Patent:

20130302126, Nov 14, 2013

Filed:

May 10, 2012

Appl. No.:

13/468134

Inventors:

Jason Schaller - Austin TX, US
Robert Vopat - Austin TX, US

Assignee:

VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. - Gloucester MA

International Classification:

B66C 1/02
B25J 15/06

US Classification:

414737, 294183

Abstract:

A rotary end effector for use for the high speed handling of workpieces, such as solar cells, is disclosed. The rotary end effector is capable of infinite rotation. The rotary end effector has a gripper bracket, capable of supporting a plurality of grippers, arranged in any configuration, such as a 4×1 linear array. Each gripper is in communication with a suction system, wherein, in some embodiments, each gripper can be selectively enabled and disabled. Provisions are also made to allow electrical components, such as proximity sensors, to be mounted on the rotating gripper bracket. In another embodiment, an end effector with multiple surfaces, each with a plurality of grippers, is used.